Jürgen Schulz-Harder

Dbc (direct bond copper) substrate with integrated flat heat pipe

A novel heat pipe design was developed consisting or a ceramic substrate sandwich with integrated flat heat pipe. On both sides of the heat pipe active electronic components, such as IGBTs or MOSFETs, can be mounted on an etched copper circuit. Heat densities over 80 W/cm2 can be dissipated easily. The functionality is independent of the working position either horizontal or vertical. The heat pipe can be used to an internal pressure over 7 bars without cracking the ceramic substrate. All requirements for space applications could be fulfilled. First application is foreseen for cooling DC-DC converters in satellites

DBC Technology for Extremely Thin Flat Heat Pipes

This paper presents the concept and experimental demonstration of flat copper heat pipe (HP) embedded in extremely thin 3-D packaging substrates. Since conventional machining for this application is very complicated and expensive, the direct bonded copper (DBC) technology proved to be interesting for mass production. The experimental results demonstrated that the DBC HP is an excellent solution to enhance the heat transfer within the 3-D packaging.