Slavka Tzanova

Internet-based performance-centered learning environment for Curriculum Support (IPLECS) and its application in mLearning

IPLECS is a virtual campus platform for the development of performance-centered reusable learning materials, and its application in mLearning for educational and training purposes. The combination of performance support systems and mobile devices present both opportunities and challenges for work-based learning design.

Labor-oriented online master degree program

This contribution reports on a new European project, Remote-labs Access in Internet-based Performance-Centered Learning Environment for Curriculum Support (RIPLECS), in which an official inter-institutional European master degree program in Information and Communication System (ICS) is created. The program is conducted online across five European institutions and is oriented to labor market needs for qualified graduates, with special focus on realizing real-world experiments in each subject remotely. The network architecture of RIPLECS platform enables world-wide distribution of learning resources by utilizing multiple Web servers at several European universities, within a single network topology. The paper discusses the project development stages, implementation and the expected outcomes.

Training microsystems technologies in an European eLearning environment

The paper presents the ongoing activities within an European project for development of eLearning courses in microsystem technologies. It is a two-year project within the Leonardo da Vinci programme and the partners are from small and medium enterprises in microelectronics, training organizations and universities from four European countries — Romania, Bulgaria, France and Germany. The project is aimed at implementation of innovative approaches for performance- centred learning and development of new instruments in instructional design of task-performance-centred courses for education in Microsystems design and technology.

New assembling technique for BGA packages without thermal processes

Abstract A new assembling technique for flip-chip mounting without heating processes was developed. The proposed construction is an FR4 substrate with ring shaped connectors. It is a typical flip-chip technology. The chip is placed, with its active part face-down, directly on to the connecting areas of the substrate. The electrical connection is obtained through a mechanical contact between the ring-shaped clips and the chip bumps. The main advantage of the ring-clip-bump attachment technique is the possibility for multi-chip modules repairing without thermal processes. It is a lead-free assembling technology involving only “conventional” processes.

Electrical characterization of transparent organic conducting thin films preventing mechanical damage and preserving optical transparency

In this paper we propose the use of underlying ITO/glass or ITO/PET electrode structures for reliable conductivity measurements of transparent organic thin films. This technique avoids any mechanical damage of the organic thin film and furthermore preserves its optical transparency. Thin PEDOT:PSS layers with various secondary dopant concentrations of dimethyl sulfoxide (DMSO) have been studied. In particular, the degeneration under UV exposure has been investigated by electrical probing and atomic force microscopy. We find that the conductivity degeneration of PEDOT:PSS under UV exposure is reduced by a factor of two for the layers with DMSO doping.

Mobile technology enhanced learning (performance-centered approach)

A review of the literature and our own experience is Engineering education reveals the following four major issues in delivering effective instruction: Problems in Content Understanding, Problems in Concentration and Lack of Variety, Need for Multiple Explanations, and Lack of Assistance. Performance-centred approach helps in solving all these four problems. Mobile technology enhanced learning will contribute to the continued development of mobile learning and to address the imbalance between the availability of mobile devices and the lack of education and training provision on the sophisticated communications devices which every student and actively working person carries and uses constantly - except in education.

Conception and test of flat heat pipe for 3D packaging cooling

This paper presents the conception and the experimental investigation on flat heat pipe with sintered powder wick structure and very thin wails. The heat pipe is integrated in the substrate of a 3D packaging to enhance the heat transfer within the module. The design of the heat pipe is retained to satisfy to the dimensioning, the mechanical and the heat dissipation requirements. The material and the structure have been selected after performing mechanical simulations with ANSYS. 2D hydraulic model to optimize the HP dimensioning and predict the heat capacity of the heat pipe is also presented. The model is in a very good conformity with the experimental results, also described in this paper.

2D numerical modeling of the thermal and hydraulic performances of a very thin sintered powder copper flat heat pipe

As integrated circuits become faster and more densely packed with transistors, conventional methods of cooling are not able to overcome the heat problem. Recently heat pipes have proven their efficiency for many applications where high heat fluxes suppress the possibility of using conventional cooling systems. The presented work aims to find efficient passive thermal solution for double sided electronic substrate, part of multifunctional 3D electronic module (European project “Microcooling”). Integrating heat pipe into the double sided slices satisfies the heat transfer requirements and minimizes the overall dimensions of the 3D packaging. To improve the design of the device under test and to provide better understanding of the physical phenomena of the fluid flow and heat transfer in the heat pipes, simplified 2D model was created. Further, according to the real prototype and the experimental setup, the simplified model was developed in more detailed formulation. The results are presented in terms of liquid and vapor pressures within the heat pipe and maximal heat power. Experimental validation, which proves that the new model can be used to predict the heat capacity and to improve the design of flat heat pipes for specific applications, is also presented.

MicroElectronics Cloud Alliance (MECA) — Presentation of a new Erasmus+ project

The MicroElectronics Cloud Alliance (MECA) Erasmus+ project (562206-EPP-1-2015-1-BG-EPPKA2-KA, 2016-18) brings together 18 partners from higher education institutions (HEIs) and enterprises (SMEs) to develop cloud-based European infrastructure and organisation for education in micro- and nanoelectronics providing a range of Open Educational Resources (OERs); remote access and sharing of educational and professional software; remote and practice-based learning facilities. Eight European HEIs and eight SMEs develop e-learning courses on: CAD systems, microelectronics technologies, test, characterisation and application of integrated circuits and systems; and they are to be provided as open educational resources to promote virtual mobility. Each university will provide remote access to its facilities, laboratory experiments or software systems for the partners in a cloud teaching system, giving them access to new resources. By providing accessibility of all developed e-learning materials as OERs, the university-business alliance will have impact on the education to be more responsive to labour market needs, thus the graduated students will be better prepared for the jobs, and the enterprises will be satisfied by the knowledge and skills of young specialists.

Innovations in Bulgarian higher education in electronics through development of a simulation-based, project driven learning environment

This paper describes innovations in Bulgarian higher engineering education-distance learning, virtual technologies and multimedia in electronics as outcomes of a three years international project. In compliance with the project objectives a new unit-an Innovative Center for Open and Distance Learning and Multimedia-was established at the Faculty of Electronics. A hybrid model which combined face-to-face instruction with the approaches of distance learning and multimedia methods was designed to integrate modern learning methods and technologies into traditional university teaching.