Jyh-Ming Jong

Equivalent circuit modeling of interconnects from time domain measurements

A technique for the equivalent circuit modeling of interconnects having discontinuities such as bends, steps, and junctions in high-speed circuits and packages is developed. The circuit models are extracted from time domain reflection (TDR) measurements. The simulated results for the circuit models are compared with the measured data to validate the accuracy of the circuit model. The proposed method can be used to help validate circuit models based on field-theoretic techniques as well as used as an independent tool to synthesize circuit models for general nonuniform or interacting two- and three-dimensional interconnects. >

Time-domain characterization of interconnect discontinuities in high-speed circuits

Experimental techniques to characterize typical interconnect discontinuities such as bends and steps, based on time-domain reflection (TDR) measurements, are formulated. These interconnect discontinuities are characterized in terms of general lumped/distributed circuit models which are compatible with CAD simulation tools such as SPICE. The results for the model element values are shown to be consistent with frequency-domain lumped equivalent models for microstrips derived from S-parameter measurements and electromagnetic computations based on the excess inductance and capacitance concepts. The models are also validated by simulating their step response on SPICE and comparing them with the TDR data. >

Time-domain characterization and circuit modeling of a multilayer ceramic package

The dynamic deconvolution (peeling algorithm) used in the past for single interconnects is extended to multiple-coupled interconnects and used to model high-speed electronic packages. A multilayer ceramic package (MLC) is used as vehicle to demonstrate the characterization and equivalent circuit modeling procedure based on single and multiport time-domain measurement.

Modeling and simulation of switching noise with the associated package resonance for high speed digital circuits

In this paper, a circuit modeling technique based on time domain measurements for power/ground systems in electronic packages is presented. Equivalent circuit model of power/ground systems for an MLC package is then incorporated with the circuit model of high speed digital drivers for switching noise simulation.

Lossy interconnect modeling from TDR/T measurements

An experimental technique for the equivalent circuit modeling of lossy interconnects is presented. The technique is based on the extended peeling algorithm and is used to extract the circuit model from the TDR/T measured data. The accuracy of the circuit model is affirmed by comparing the measured results with the simulated results for a thin film microstrip line.

A model for parallel semi infinite conducting planes

A frequency-dependent nonuniform transmission line model for parallel semi-infinite conducting power/ground planes is presented. The model is validated by comparing the calculated time domain response with the measured time domain reflectometer (TDR) data.<<ETX>>

Time domain characterization of coupled interconnects and discontinuities

A time domain experimental technique for the characterization and modeling of general coupled interconnects and discontinuities is presented. The technique is based on a two-dimensional peeling algorithm and is validated by comparing the results obtained experimentally for the self and mutual equivalent circuit parameters with the theoretical predictions for a non symmetrical inhomogeneous coupled interconnect test structure.<<ETX>>

Measurements and characterization of multiple-coupled interconnection lines in hybrid and monolithic integrated circuits

(5)eI(t-TN)The delays are obtained from the measurements as the time differences between the exciting step and thevarious transitions in the far end port waveforms. All N eigenvalues are obtained by using these waveformsor the reflected signal with open ended transmission lines to enhance the sensitivity. Frequency domainresonance measurements can also be used for accurate evaluation of the eigenvalues. The temporally spreadmodal output is then given by,

Modeling and simulation of switching noise including power/ground plane resonance for high speed GaAs FET logic (FL) circuits

Equivalent circuit models of power/ground plane structures in high speed/frequency electronic packages used for switching noise and ground bounce simulation are presented. As an example, the effect of package resonance on the switching noise due to edge and clock rates of the GaAs FET logic (FL) inverter is reported for a typical MLC package.<<ETX>>

Spectral domain quasi-TEM computation of the propagation characteristics of single and coupled interconnects with meshed ground planes

The impedances, wave velocities and crosstalk coupling coefficients for interconnects with rectangular meshed ground planes are calculated by using the quasi-transverse electromagnetic wave (TEM) spectral domain technique. The impedance calculated are compared with measured data as a function of the mesh size and the trace position and direction with respect to the mesh plane orientation.<<ETX>>