Leonard A. Hayden
Oregon State University
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Featured researches published by Leonard A. Hayden.
international microwave symposium | 1997
Saswata Basu; Leonard A. Hayden
Orthogonal CPW thrus are notorious for generating undesired modes due to the bend discontinuity. These undesired modes are not accounted for in conventional calibration methods such as SOLT, LRM, and TRL, since they require, by definition, well-behaved thru standards. In this paper, we will demonstrate through experimental results how the Short-Open-Load-Reciprocal thru (SOLR) approach, which avoids imposing any dependency on the nature of the thru standard itself, provides a superior calibration.
IEEE Transactions on Microwave Theory and Techniques | 1993
Leonard A. Hayden; Vijai K. Tripathi
Accurate calibration techniques for the characterization of general one- and two-port networks using time domain reflection/transmission (TDR/T) measurements are presented. Simple one-port open-short-match corrections formulated by W.M. Scott and G.S. Smith (1986) are generalized for three arbitrary known loads and extended to the two-port case. Known, general frequency-domain techniques are shown to be directly applicable to the time-domain measurements, including the use of redundancy to reduce the number of required calibration standards. A time-domain thru-match-short method similar to the TRL method of G.F. Engen and C.A. Hoer (1979) is presented. Examples of the measured results for typical one- and two-port devices are included and compared with vector network analyzer measurement results to validate the time domain network analysis algorithms. >
IEEE Transactions on Microwave Theory and Techniques | 1991
Leonard A. Hayden; Vijai K. Tripathi
The Fourier transform relationship between frequency response and impedance profile for single nonuniform transmission lines is used to derive the time-domain step response of single and coupled nonuniform lines. The expression for the step response of a characteristically terminated nonuniformly coupled transmission line structure is shown to correspond to the characteristic impedance profile. By using this relationship, any arbitrary step response can be realizing by utilizing nonuniformly coupled strip or microstrip lines for possible applications as waveform-shaping networks and chirp filters. A numerical procedure to compute the step response of the nonuniform coupled line four-port is also formulated in terms of frequency-domain parameters of an equivalent cascaded uniform coupled line model with a large number of sections. Sinusoidal and chirp responses are presented as examples that are readily implemented using coupling microstrip structures. The step response of an experimental nonuniformly coupled microstrip structure is presented to validate the theoretical results. >
electrical performance of electronic packaging | 1994
Jyh-Ming Jong; Vijai K. Tripathi; Leonard A. Hayden; B. Janko
An experimental technique for the equivalent circuit modeling of lossy interconnects is presented. The technique is based on the extended peeling algorithm and is used to extract the circuit model from the TDR/T measured data. The accuracy of the circuit model is affirmed by comparing the measured results with the simulated results for a thin film microstrip line.
international microwave symposium | 1994
Jyh-Ming Jong; Leonard A. Hayden; Vijai K. Tripathi
A time domain experimental technique for the characterization and modeling of general coupled interconnects and discontinuities is presented. The technique is based on a two-dimensional peeling algorithm and is validated by comparing the results obtained experimentally for the self and mutual equivalent circuit parameters with the theoretical predictions for a non symmetrical inhomogeneous coupled interconnect test structure.<<ETX>>
electrical performance of electronic packaging | 1994
Leonard A. Hayden; Vijai K. Tripathi
This paper presents an introduction to pulse signaling, a circuit design approach to circumvent performance limitations of electronic packaging. Potential benefits, such as reduced power consumption, are demonstrated using examples from proposed Capacitively-Coupled CMOS circuits.
Microelectronic Interconnects and Packages: Optical and Electrical Technologies | 1991
Leonard A. Hayden; Jyh-Ming Jong; John B. Rettig; Vijai K. Tripathi
(5)eI(t-TN)The delays are obtained from the measurements as the time differences between the exciting step and thevarious transitions in the far end port waveforms. All N eigenvalues are obtained by using these waveformsor the reflected signal with open ended transmission lines to enhance the sensitivity. Frequency domainresonance measurements can also be used for accurate evaluation of the eigenvalues. The temporally spreadmodal output is then given by,
Microelectronic Interconnects and Packages: Optical and Electrical Technologies | 1991
Neven Orhanovic; Leonard A. Hayden; Vijai K. Tripathi
Analytical and numerical techniques formulated to model uniform and nonuniform lines are used to compute signal delays distortion and crosstalk in interconnects and packaging. The techniques presented include the use of CAD compatible circuit models and computational techniques based on time and frequency domain solution of multiconductor lossy interconnects. Typical numerical results for the pulse propagation characteristics of uniformly and nonuniformly coupled interconnects are presented.© (1991) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.
electrical performance of electronic packaging | 1993
Leonard A. Hayden; Jyh-Ming Jong; Vijai K. Tripathi
An experimental method for the time domain characterization of a class of nonuniformly coupled interconnection lines is presented. Electrical circuit models for constant velocity structures are extracted from time domain reflection (TDR) measurements.<<ETX>>
electrical performance of electronic packaging | 1994
Leonard A. Hayden; Roger B. Marks
This paper examines time domain methods for characterizing signal propagation in uniform transmission lines. The impact of the limitations associated with time domain instrumentation and methodologies are examined and guidelines for minimizing errors are presented.