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Karl-Heinz Langsdorf

Hess Corporation

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Publication

Featured researches published by Karl-Heinz Langsdorf.

Archive | 1993

Process for manufacturing semiconductor wafers having deformation ground in a defined way

Anton Huber; Karl-Heinz Langsdorf

Archive | 1987

Process for sawing crystal rods or blocks into thin wafers

Gerhard Dr. Dipl.-Ing. Brehm; Karl-Heinz Langsdorf; Johann Niedermeier; Johann Glas

Archive | 1993

Wafer with defined grinded warp and process for manufacturing

Anton Huber; Karl-Heinz Langsdorf

Archive | 1987

Process for sawing crystal rods or blocks into thin wafers using an annular blade saw

Gerhard Dr. Dipl.-Ing. Brehm; Karl-Heinz Langsdorf; Johann Niedermeier; Johann Glas

Archive | 1987

Process and device for the correction of the cutting direction for sawing crystal rods or blocks

Gerhard Dr. Dipl.-Ing. Brehm; Karl-Heinz Langsdorf; Johann Niedermeier; Johann Glas

Archive | 1993

Process for manufacturing a wafer with defined ground rotational symmetric warp

Anton Huber; Karl-Heinz Langsdorf

Archive | 2001

Method of manufacturing a semiconductor wafer

Anton Huber; Karl-Heinz Langsdorf

Archive | 1992

Semiconductor wafers with defined milled deformation and processes for their preparation

Anton Huber; Karl-Heinz Langsdorf

Archive | 1992

Halbleiterscheiben mit definiert geschliffener Verformung und Verfahren zu ihrer Herstellung Semiconductor wafers having defined deformation milled and processes for their preparation

Anton Huber; Karl-Heinz Langsdorf

Archive | 1987

Verfahren und Vorrichtung zur Korrektur des Schnittverlaufs beim Zersägen von Kristallstäben oder -blöcken.

Gerhard Dr. Dipl.-Ing. Brehm; Karl-Heinz Langsdorf; Johann Niedermeier; Johann Glas

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Collaboration

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Anton Huber

Hess Corporation

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Gerhard Dr. Dipl.-Ing. Brehm

Hess Corporation

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Johann Niedermeier

Hess Corporation

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Johann Glas

Hess Corporation

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