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Featured researches published by Kazuhiro Akiyama.


Scientific Reports | 2016

Atomic structures of a liquid-phase bonded metal/nitride heterointerface

Akihito Kumamoto; Naoya Shibata; Kei-ichiro Nayuki; Tetsuya Tohei; Nobuyuki Terasaki; Yoshiyuki Nagatomo; Toshiyuki Nagase; Kazuhiro Akiyama; Yoshirou Kuromitsu; Yuichi Ikuhara

Liquid-phase bonding is a technologically important method to fabricate high-performance metal/ceramic heterostructures used for power electronic devices. However, the atomic-scale mechanisms of how these two dissimilar crystals specifically bond at the interfaces are still not well understood. Here we analyse the atomically-resolved structure of a liquid-phase bonded heterointerface between Al alloy and AlN single crystal using aberration corrected scanning transmission electron microscopy (STEM). In addition, energy-dispersive X-ray microanalysis, using dual silicon drift X-ray detectors in STEM, was performed to analyze the local chemistry of the interface. We find that a monolayer of MgO is spontaneously formed on the AlN substrate surface and that a polarity-inverted monolayer of AlN is grown on top of it. Thus, the Al alloy is bonded with the polarity-inverted AlN monolayer, creating a complex atomic-scale layered structure, facilitating the bonding between the two dissimilar crystals during liquid-phase bonding processes. Density-functional-theory calculations confirm that the bonding stability is strongly dependent on the polarity and stacking of AlN and MgO monolayers. Understanding the spontaneous formation of layered transition structures at the heterointerface will be key in fabricating very stable Al alloy/AlN heterointerface required for high reliability power electronic devices.


Surface & Coatings Technology | 1997

A study of the adhesion between CVD layers and a cemented carbide substrate by AEM analysis

Kazuhiro Akiyama; Eiji Nakamura; Ikuro Suzuki; Takatoshi Oshika; Akio Nishiyama; Yoshihiro Sawada

Abstract The interface between chemical vapor deposition (CVD) coated layers and cemented carbide substrate of coated cemented carbide inserts was analyzed by analytical electron microscopy (AEM). This analysis was carried out from the viewpoint of the adhesion of the coated layer. From the results of elemental analysis, it became clear that the amounts of W and Co diffused from the substrate into the coated layer were different among three coating conditions. A columnar TiCN grain produced in relatively low temperature scarcely contained these elements, and they were detected only at the grain boundary. On the other hand, these elements diffused inside the grains when the shape of the grain was granular as TiN. Strong adhesion of coated layer was obtained when a proper amount of these elements was diffused. Coated inserts containing an interfacial layer with suitable diffused materials and main columnar TiCN layer showed good cutting performance.


Archive | 1999

Cemented carbide cutting tool

Toshiyuki Taniuchi; Kazuki Okada; Kazuhiro Akiyama


Archive | 1995

Coated tungsten carbide-based cemented carbide blade member

Eiji Nakamura; Kazuhiro Akiyama; Ikuro Suzuki


Archive | 2013

Power module substrate, power module, and method for manufacturing power module substrate

Yoshirou Kuromitsu; Kazuhiro Akiyama; Takeshi Kitahara; Hiroshi Tonomura


Archive | 1991

Method of gettering unintentional mobile impurities in silicon wafer by using a damaged layer exposed to the reverse surface thereof

Hisaaki Suga; Yoshinobu Nakada; Kazuhiro Akiyama; Shunji Ishibashi


Journal of the American Ceramic Society | 2005

Configurational Observation of Titanium Oxide Pigment Particles

Kazuhiro Akiyama; Nosho Toyama; Kazuyoshi Muraoka; Makoto Tsunashima


Archive | 2009

Substrate for power module, power module, and method for producing substrate for power module

Yoshirou Kuromitsu; Kazuhiro Akiyama; Takeshi Kitahara; Hiroshi Tonomura


Archive | 2010

Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module

Yoshiyuki Nagatomo; Kazuhiro Akiyama; Hiroshi Tonomura; Nobuyuki Terasaki; Yoshirou Kuromitsu


Archive | 2011

SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND POWER MODULE

Kazuhiro Akiyama; Yoshio Kuromitsu; Yoshiyuki Nagatomo; Nobuyuki Terasaki; Hiroshi Tonomura; 伸幸 寺▲崎▼; 宏史 殿村; 和裕 秋山; 義幸 長友; 祥郎 黒光

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Yoshirou Kuromitsu

MITSUBISHI MATERIALS CORPORATION

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Hiroshi Tonomura

MITSUBISHI MATERIALS CORPORATION

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Yoshiyuki Nagatomo

MITSUBISHI MATERIALS CORPORATION

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Nobuyuki Terasaki

MITSUBISHI MATERIALS CORPORATION

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Eiji Nakamura

MITSUBISHI MATERIALS CORPORATION

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Ikuro Suzuki

MITSUBISHI MATERIALS CORPORATION

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Takeshi Kitahara

MITSUBISHI MATERIALS CORPORATION

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