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Dive into the research topics where Nobuyuki Terasaki is active.

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Featured researches published by Nobuyuki Terasaki.


Scientific Reports | 2016

Atomic structures of a liquid-phase bonded metal/nitride heterointerface

Akihito Kumamoto; Naoya Shibata; Kei-ichiro Nayuki; Tetsuya Tohei; Nobuyuki Terasaki; Yoshiyuki Nagatomo; Toshiyuki Nagase; Kazuhiro Akiyama; Yoshirou Kuromitsu; Yuichi Ikuhara

Liquid-phase bonding is a technologically important method to fabricate high-performance metal/ceramic heterostructures used for power electronic devices. However, the atomic-scale mechanisms of how these two dissimilar crystals specifically bond at the interfaces are still not well understood. Here we analyse the atomically-resolved structure of a liquid-phase bonded heterointerface between Al alloy and AlN single crystal using aberration corrected scanning transmission electron microscopy (STEM). In addition, energy-dispersive X-ray microanalysis, using dual silicon drift X-ray detectors in STEM, was performed to analyze the local chemistry of the interface. We find that a monolayer of MgO is spontaneously formed on the AlN substrate surface and that a polarity-inverted monolayer of AlN is grown on top of it. Thus, the Al alloy is bonded with the polarity-inverted AlN monolayer, creating a complex atomic-scale layered structure, facilitating the bonding between the two dissimilar crystals during liquid-phase bonding processes. Density-functional-theory calculations confirm that the bonding stability is strongly dependent on the polarity and stacking of AlN and MgO monolayers. Understanding the spontaneous formation of layered transition structures at the heterointerface will be key in fabricating very stable Al alloy/AlN heterointerface required for high reliability power electronic devices.


Archive | 2014

METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE

Nobuyuki Terasaki; Yoshiyuki Nagatomo


Archive | 2010

Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module

Yoshiyuki Nagatomo; Kazuhiro Akiyama; Hiroshi Tonomura; Nobuyuki Terasaki; Yoshirou Kuromitsu


Archive | 2011

SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND POWER MODULE

Kazuhiro Akiyama; Yoshio Kuromitsu; Yoshiyuki Nagatomo; Nobuyuki Terasaki; Hiroshi Tonomura; 伸幸 寺▲崎▼; 宏史 殿村; 和裕 秋山; 義幸 長友; 祥郎 黒光


Archive | 2014

BONDING BODY, POWER MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE

Nobuyuki Terasaki; Yoshiyuki Nagatomo


Archive | 2014

POWER MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE

Toshiyuki Nagase; Yoshiyuki Nagatomo; Nobuyuki Terasaki


Archive | 2013

CONJUGATE, SUBSTRATE FOR POWER MODULE, AND SUBSTRATE FOR POWER MODULE WITH HEAT SINK

Nobuyuki Terasaki; 伸幸 寺▲崎▼; Yoshiyuki Nagatomo; 義幸 長友


Archive | 2013

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, AND METHOD OF MANUFACTURING POWER MODULE SUBSTRATE

Yoshirou Kuromitsu; Yoshiyuki Nagatomo; Nobuyuki Terasaki; Toshio Sakamoto; Kazunari Maki; Hiroyuki Mori; Isao Arai


Archive | 2013

Substrate for power modules, substrate with heat sink for power modules, power module, method for producing substrate for power modules, and paste for bonding copper member

Nobuyuki Terasaki; Yoshiyuki Nagatomo; Kimihito Nishikawa; Yoshirou Kuromitsu


Archive | 2013

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF MANUFACTURING POWER MODULE SUBSTRATE, AND COPPER MEMBER-BONDING PASTE

Nobuyuki Terasaki; Yoshiyuki Nagatomo; Kimihito Nishikawa; Yoshirou Kuromitsu

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Yoshiyuki Nagatomo

MITSUBISHI MATERIALS CORPORATION

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Yoshirou Kuromitsu

MITSUBISHI MATERIALS CORPORATION

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Toshiyuki Nagase

MITSUBISHI MATERIALS CORPORATION

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Kazuhiro Akiyama

MITSUBISHI MATERIALS CORPORATION

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Hiroshi Tonomura

MITSUBISHI MATERIALS CORPORATION

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Kimihito Nishikawa

MITSUBISHI MATERIALS CORPORATION

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Yuichi Ikuhara

Tokyo Institute of Technology

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