Kazuma Tachibana

Improvement of Removal Rate in Abrasive-Free Planarization of 4H-SiC Substrates Using Catalytic Platinum and Hydrofluoric Acid

We used catalyst-referred etching, which is an abrasive-free planarization method, to produce an extremely smooth surface on a 4H-SiC substrate. However, the removal rate was lower than that obtained by chemical mechanical polishing, which is the planarization method generally used for SiC substrates. To improve the removal rate, we investigated its dependence on rotational velocity and processing pressure. We found that the removal rate increases in proportion to both rotational velocity and processing pressure. A lapped 4H-SiC substrate was planarized under conditions that achieved the highest removal rate of approximately 500 nm/h. A smooth surface with a root-mean square roughness of less than 0.1 nm was fabricated within 15 min. Because the surface, which was processed under conditions of high rotational velocity and high processing pressure, consisted of a step–terrace structure, it was well ordered up to the topmost surface.

Reduction of Surface Roughness of 4H-SiC by Catalyst-Referred Etching

Flat and well-ordered surfaces of silicon carbide (SiC) substrates are important for electronic devices. Furthermore, researchers have reported that 4H-SiC surface roughness increases by step-bunching during epitaxial growth and annealing. Degradation of device properties induced by surface roughening is of great concern. Therefore, a method to reduce this surface roughening is requested. We have developed a damage-free planarization method called catalyst-referred etching (CARE). In this paper, we planarized 4H-SiC substrates and evaluated the processed surface before and after the epitaxial growth. Then, we reduced the step-bunching on the epi-wafer surface and determined the electrical properties of the Schottky barrier diodes (SBD) on the processed surface.

TEM Observation of 8 Deg Off-Axis 4H-SiC (0001) Surfaces Planarized by Catalyst-Referred Etching

We have developed a novel abrasive-free planarization method called catalyst-referred etching (CARE). A CARE-processed 8 deg off-axis 4H-SiC (0001) surface is investigated by cross-sectional transmission electron microscopy (TEM). The surface is composed of alternating wide and narrow terraces with single-bilayer-height steps, which are similar to the structure observed on a CARE-processed on-axis 4H-SiC (0001) surface. These results indicate that the structure appears on CARE-processed surfaces regardless of the off-cut angle.

Study on Reactive Species in Catalyst-Referred Etching of 4H–SiC using Platinum and Hydrofluoric Acid

In this study, we developed aA novel abrasive-free polishing method called the catalyst-referred etching (CARE) has been developed. CARE can chemically remove SiC chemically with using an etching agent activated by a catalyst. Platinum and hydrofluoric (HF) acid are used for the planarization of SiC substrates as a catalyst and etchant, respectively. CARE can produce an atomically flat surface of 4H–SiC (0001) with a root-mean-square roughness of less than <0.1 nm, regardless of the cut-off angle. However, the mechanism of CARE has hasis not yet been clarified to date. In this study, to clarify the mechanism, KF and NH4F are added to the etchant to clarify the mechanism. The An investigation of removal rate revealeds that the removal rate is proportional to [HF]×([F^- ]+[〖HF_2〗^- ]), and it is shown that both the HF molecule and fluorine ions (F− and HF2−) arethe reactive species of the CARE process are both HF molecule and fluorine ions (F- and HF2-).

Rapid Planarization Method by Ultraviolet Light Irradiation for Gallium Nitride Using Platinum Catalyst

We have developed a chemical process for atomic planarization of gallium nitride (GaN) using a platinum catalyst and ultraviolet (UV) light irradiation. The process is mediated by a hydrolysis reaction catalyzed by platinum as a solid catalyst. Because the reaction occurs selectively from the step edges, a flat surface composed of a straight step-and-terrace structure is obtained. In the absence of UV light, owing to the low step edge density, the removal rate is quite slow, approximately 1 nm/h. In contrast, under UV light, etch pits are formed on the terraces by photo-electrochemical etching causing an increase in the step edge density. We achieved surface planarization with a removal rate of 9.6 nm/h assisted by irradiation with UV light.

Surface Observation of 4H-SiC (0001) Planarized by Catalyst-Referred Etching

We have developed a novel planarization method called catalyst-referred etching (CARE), which can planarize SiC substrates without the use of an abrasive. In this method, platinum is used as an oxidation catalyst. The surface of CARE-processed 4H-SiC (0001) substrates are atomically flat all over the wafer. It is found that the surface of CARE-processed substrates is composed of alternating wide and narrow terraces with single bilayer-height steps, regardless of the off-cut angle. This unique structure is induced by the differences in the chemical stabilities of the terraces.