Kazunori Omoya

A Stud-bump-bonding Technique For High Density Multi-chip-module

technique for high density Multi-Chip-Module (MCM), using called Stud-Bump-Bonding (SBB) technique, which can bond bare LSI chips directly to ceramic substrate. Au bump is formed on electrode pad of LSI chip by a wirebonding apparatus. Each Au bump has two-stepped construction and bonded with a conductive adhesive to an electrode terminal formed on the ceramic substrate. The conductive adhesive is very flexible and strong in bond, thus resisting thermal and mechanical stresses. Moreover, repair technique has been developed. 100 ,u m pitch electrode pads of LSI chip can be bonded to electrode terminals. The bonding resistance is less than 50 m i l . memory module. High density and reliability in bonding for MCM have been attained by the SBB technique. We have developed advanced flip-chip bonding We have applied the SBB technique to high density MCM for