Kazuo Hirota

Method of manufacturing probing head for testing equipment of semi-conductor large scale integrated circuits

A probe head for use with equipment for testing a semiconductor device such as a large scale integrated circuit (LSI) includes electrode pads are formed on a circuit substrate, and a pad protecting conductive layer formed on the pads. A probe pin forming material is grown which is worked into a pin-like configuration, thereby improving a pin assembling property of a probe head portion and this realizes highly accurate pinning with high reliability.

New drive system and packaging method for magnetic bubble memory

We developed a new drive system and packaging method for magnetic bubble memory. Coils wound around a picture frame core and surrounded by a conductive shield box make the rotational magnetic drive field uniform and exist only in very limited space. A flexible printed circuit is used to reduce the space for I/O signal wiring. Using these with a 4-Mbit, 15.4mm × 15.6mm chip, we demonstrated a significantly miniaturized module with a size of 24mm × 24mm × 6mm, approximately one fourth that of the conventional one. This will extend the application range of the magnetic bubble memory.