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Latest external collaboration on country level. Dive into details by clicking on the dots.

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Dive into the research topics where Teruki Aizawa is active.

Publication


Featured researches published by Teruki Aizawa.


Archive | 2002

Method for producing benzoxazine resin

Teruki Aizawa; Yasuyuki Hirai; Syunichi Numata


Archive | 1997

Thermosetting resin composition, cured product, prepreg, metal-clad laminate and wiring board

Hideo Nagase; Teruki Aizawa; Yasuyuki Hirai; Yoshihiko Sato


Archive | 1997

Epoxy resin composition, epoxy resin prepreg and epoxy resin laminate

Teruki Aizawa; Yasuyuki Hirai; Minoru Kakiya; Shinichi Kamoshita; Hideo Nagase; Ken Nanaumi; Shunichi Numata; Kenichi Ohori; Yoshinori Sato; 憲 七海; 義則 佐藤; 稔 垣谷; 健一 大堀; 康之 平井; 俊一 沼田; 輝樹 相沢; 英雄 長瀬; 真一 鴨志田


Archive | 1998

Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound

Yasuyuki Hirai; Teruki Aizawa; Yukio Yoshimura


Archive | 1998

THERMOCURABLE RESIN COMPOSITION, PREPREG AND LAMINATED BOARD FOR PRINTED CIRCUIT BOARD

Teruki Aizawa; Yasuyuki Hirai; Minoru Kakiya; Shinichi Kamoshita; Kenichi Ohori; 稔 垣谷; 健一 大堀; 康之 平井; 輝樹 相沢; 真一 鴨志田


Archive | 1997

Resin composition for semiconductor sealing and resin-sealed type semiconductor device sealed with the composition

Teruki Aizawa; Masanobu Fujii; Fumio Furusawa; Yasuyuki Hirai; Tatsuo Kawada; Hideo Nagase; Shunichi Numata; Akihiko Sato; 愛彦 佐藤; 文夫 古沢; 康之 平井; 達男 河田; 俊一 沼田; 輝樹 相沢; 昌信 藤井; 英雄 長瀬


Archive | 1999

Epoxy resin composition and insulation resin sheet for printed wiring board

Teruki Aizawa; Tetsuo Eda; Kiyoshi Hirozawa; Yoshitoshi Kumakura; Yuji Tosaka; 清 広沢; 鉄夫 枝; 俊寿 熊倉; 祐治 登坂; 輝樹 相沢


Archive | 1998

Photosensitive resin composition and production of solder resist using that

Teruki Aizawa; Hiroyuki Kawakami; Hiroshi Nishizawa; Shunichi Numata; Fumihiko Ota; Shinji Tsuchikawa; 信次 土川; 文彦 太田; 広幸 川上; 俊一 沼田; 輝樹 相沢; ▲廣▼ 西澤


Archive | 1997

Adhesive composition, multilayer printed circuit board prepared by using the same, and production of multilayer printed circuit board

Teruki Aizawa; Yasuyuki Hirai; Minoru Kakiya; Shinichi Kamoshita; Hideo Nagase; Yoshinori Sato; 義則 佐藤; 稔 垣谷; 康之 平井; 輝樹 相沢; 英雄 長瀬; 真一 鴨志田


Archive | 1997

Thermosetting composition and its hardened material

Teruki Aizawa; Yasuyuki Hirai; Minoru Kakiya; Shinichi Kamoshita; Hideo Nagase; Shunichi Numata; Yoshinori Sato; 義則 佐藤; 稔 垣谷; 康之 平井; 俊一 沼田; 輝樹 相沢; 英雄 長瀬; 真一 鴨志田

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