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Kenichi Iwashita

Hitachi

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Publication

Featured researches published by Kenichi Iwashita.

Archive | 2008

Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part

Tomonori Minegishi; Rika Nogita; Kenichi Iwashita

Archive | 2008

PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURING FILM USING THE SAME, AND ELECTRONIC COMPONENT

Kenichi Iwashita; Tomonori Minegishi; Rika Nokita; 健一 岩下; 知典 峯岸; 里花 野北

Archive | 2008

PHOTOSENSITIVE RESIN COMPOSITION, AND POLYBENZOXAZOLE FILM, METHOD FOR PRODUCING PATTERNED CURED FILM AND ELECTRONIC COMPONENT USING RESIN COMPOSITION

Kenichi Iwashita; Tomonori Minegishi; Rika Nokita; 健一 岩下; 知典 峯岸; 里花 野北

Archive | 2008

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, PHOTOSENSITIVE-RESIN COMPOSITION AND ELECTRONIC COMPONENT

Kenichi Iwashita; 健一 岩下

Journal of Photopolymer Science and Technology | 2015

Study of Adhesion Properties of Cu on Photosensitive Insulation Film for Next Generation Packaging

Kenichi Iwashita; Tetsuya Katoh; Akihiro Nakamura; Yasuharu Murakami; Tomio Iwasaki; Yuka Sugimasa; Jun Nunoshige; Hiroshi Nakano

Archive | 2008

SURFACE TREATMENT DEVICE FOR ELECTRIC INSULATING SHEET, SURFACE TREATMENT METHOD, AND METHOD FOR PRODUCING ELECTRIC INSULATING SHEET

Kenichi Iwashita; Atsushi Sakuma; Harumi Tanaka; 敦士 佐久間; 健一 岩下; 治美 田中

Journal of Photopolymer Science and Technology | 2006

Study of Polybenzoxazole Precursors for Low Temperature Curing

Kenichi Iwashita; Takashi Hattori; Tomonori Minegishi; Shinji Ando; Fumihiro Toyokawa; Mitsuru Ueda

Archive | 2015

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, AND METHOD FOR FORMING RESIST PATTERN

Kenichi Iwashita; Yasuharu Murakami; Hanako Yori; Tetsuya Kato

Journal of microelectronics and electronic packaging | 2017

Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer

Kazuyuki Mitsukura; Masaya Toba; Kousuke Urashima; Yoshinori Ejiri; Kenichi Iwashita; Tomonori Minegishi; Kazuhiko Kurafuchi

Journal of Photopolymer Science and Technology | 2016

Novel Trench Wiring Formation Process using Photosensitive Insulation Film for Next Generation Packaging

Kenichi Iwashita; Tetsuya Katoh; Akihiro Nakamura; Yasuharu Murakami; Tomio Iwasaki

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Collaboration

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Tomonori Minegishi

Hitachi

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Yasuharu Murakami

Hitachi

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Akihiro Nakamura

Hitachi

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Rika Nogita

Hitachi

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Takashi Hattori

Hitachi

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Tetsuya Katoh

Hitachi

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Tomio Iwasaki

Hitachi

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Hanako Yori

Hitachi

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Hiroshi Nakano

Hitachi

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Jun Nunoshige

Hitachi

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