Keon Hwa Lee

Light-extraction efficiency control in AlGaN-based deep-ultraviolet flip-chip light-emitting diodes: a comparison to InGaN-based visible flip-chip light-emitting diodes.

We study light-extraction efficiency (LEE) of AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) using flip-chip (FC) devices with varied thickness in remaining sapphire substrate by experimental output power measurement and computational methods using 3-dimensional finite-difference time-domain (3D-FDTD) and Monte Carlo ray-tracing simulations. Light-output power of DUV-FCLEDs compared at a current of 20 mA increases with thicker sapphire, showing higher LEE for an LED with 250-μm-thick sapphire by ~39% than that with 100-μm-thick sapphire. In contrast, LEEs of visible FCLEDs show only marginal improvement with increasing sapphire thickness, that is, ~6% improvement for an LED with 250-μm-thick sapphire. 3D-FDTD simulation reveals a mechanism of enhanced light extraction with various sidewall roughness and thickness in sapphire substrates. Ray tracing simulation examines the light propagation behavior of DUV-FCLED structures. The enhanced output power and higher LEE strongly depends on the sidewall roughness of the sapphire substrate rather than thickness itself. The thickness starts playing a role only when the sapphire sidewalls become rough. The roughened surface of sapphire sidewall during chip-separation process is critical for TM-polarized photons from AlGaN quantum wells to escape in lateral directions before they are absorbed by p-GaN and Au-metal. Furthermore, the ray tracing results show a reasonably good agreement with the experimental result of the LEE.

High Efficiency and ESD of GaN-Based LEDs With Patterned Ion-Damaged Current Blocking Layer

This letter examined the use of a patterned ion-damaged current blocking layer (patterned-IDCBL). A 50-Å-InGaN layer grown as the top epitaxial layer was transformed into an insulator fabricated by oxygen plasma treatment, in which the dot patterns are regularly arranged over the active areas of the light-emitting diode (LED) and inserted beneath the p-electrode. The results showed that the light output power increased by 16.8% at 60 mA compared with the conventional LEDs, and that the electrostatic discharge resistance is effectively improved by the patterned-IDCBL.

Thin-Film-Flip-Chip LEDs Grown on Si Substrate Using Wafer-Level Chip-Scale Package

Demonstrated are visible GaN-based light-emitting diodes (LEDs) on economical large-area Si substrates using an advanced device and packaging architecture to improve optical output power, while reducing manufacturing costs. The process employs thin-film-flip-chip devices and wafer-level chip-scale packages and uses through-Si-via substrate and anisotropic conductive film for bonding. The improved curvature control region is applied in the epitaxial growth of the LED structure on a Si substrate to achieve flat wafers for epitaxial structures at room temperature, which is critical for wafer-level bonding. External quantum efficiency and light-output power at 350 mA increase by ~12% compared with those of conventional flip-chip LEDs grown on a sapphire substrate. The devices also show a reverse-bias leakage current failure rate of <;10%.

Visible Flip-Chip Light-Emitting Diodes on Flexible Ceramic Substrate With Improved Thermal Management

We demonstrate flip-chip light-emitting diodes (FC-LEDs) on a flexible yttria-stabilized zirconia (YSZ) substrate and compare them with FC-LEDs on a polymeric substrate. Degradation of luminescence intensity and red-shift of peak wavelength are not observed for the LED on the flexible YSZ, unlike one on the polyimide substrate, due to improved capability to remove the generated heat from the chip to the substrate. Thermal distribution measurements and finite-element simulations show improved thermal management by the flexible ceramic as compared with previously developed flexible LEDs on polymeric substrates. The results present an improved solution to high power operation of flexible LEDs.

Improved Light Extraction of GaN-Based Light-Emitting Diodes by an Ion-Damaged Current Blocking Layer

In this study we investigate an InGaN layer damaged by the bombardment of energetic oxygen ions that is placed beneath a p-electrode to act as a current blocking layer (CBL). This method not only increases light output power but also alleviates the current crowding problem. Our tests showed that the light output power was increased by 10% at 60 mA compared to conventional light-emitting diodes (LEDs). Additionally, our method improves LED productivity and effectiveness as it creates a nearly planar insulation layer through disordering or Ga sputtering of the InGaN surface and Ga2O3 formation.

Light interaction in sapphire/MgF2/Al triple-layer omnidirectional reflectors in AlGaN-based near ultraviolet light-emitting diodes.

This study examined systematically the mechanism of light interaction in the sapphire/MgF2/Al triple-layer omnidirectional reflectors (ODR) and its effects on the light output power in near ultraviolet light emitting diodes (NUV-LEDs) with the ODR. The light output power of NUV-LEDs with the triple-layer ODR structure increased with decreasing surface roughness of the sapphire backside in the ODR. Theoretical modeling of the roughened surface suggests that the dependence of the reflectance of the triple-layer ODR structure on the surface roughness can be attributed mainly to light absorption by the Al nano-structures and the trapping of scattered light in the MgF2 layer. Furthermore, the ray tracing simulation based upon the theoretical modeling showed good agreement with the measured reflectance of the ODR structure in diffuse mode.

Visible Light-Emitting Diodes With Thin-Film-Flip- Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding

Demonstrated is advanced device and packaging architecture of visible GaN-based light-emitting diodes (LEDs) combining thin-film flip-chip devices and wafer-level chip-scale package with through-silicon-via (TSV) and wafer-to-wafer alignment bonding. In addition, a new interconnect technique for LEDs is introduced using an anisotropic conductive film with metal balls. Thermal rollover in light output versus current characteristics is not observed up to 700 mA. A forward voltage at 350 mA is 3.06 V. The architecture can facilitate excellent heat removal through a TSV-formed Si wafer in addition to expected benefits of easy integration of Si-based devices in lighting modules. Light-output power at 350 mA increases by 11.1% compared with that of conventional flip-chip LEDs. A Lambertian-like emission pattern is also achieved.

III-V thin-film photovoltaic solar cells based on single-crystal-like GaAs grown on flexible metal tapes

This paper describes the demonstration of the flexible single-junction III-V solar cells based on high-quality epitaxial GaAs thin films on a low-cost flexible metal substrate. The single-crystal-like semiconductor material structure is fabricated to photovoltaic devices with front illumination geometry. We fabricate a proof-of-concept epitaxial GaAs thin film solar cell with an open-circuit voltage of 0.3 V and short-circuit current of 6 mA/cm2, resulting in conversion efficiency of ~1% in AM1.5G condition. Relatively low efficiency can be further increased by material crystalline quality improvement and device optimization. This development has the potential to open a new avenue for next-generation low-cost and high efficiency flexible PV devices.