Mojtaba Asadirad

Light-extraction efficiency control in AlGaN-based deep-ultraviolet flip-chip light-emitting diodes: a comparison to InGaN-based visible flip-chip light-emitting diodes.

We study light-extraction efficiency (LEE) of AlGaN-based deep-ultraviolet light-emitting diodes (DUV-LEDs) using flip-chip (FC) devices with varied thickness in remaining sapphire substrate by experimental output power measurement and computational methods using 3-dimensional finite-difference time-domain (3D-FDTD) and Monte Carlo ray-tracing simulations. Light-output power of DUV-FCLEDs compared at a current of 20 mA increases with thicker sapphire, showing higher LEE for an LED with 250-μm-thick sapphire by ~39% than that with 100-μm-thick sapphire. In contrast, LEEs of visible FCLEDs show only marginal improvement with increasing sapphire thickness, that is, ~6% improvement for an LED with 250-μm-thick sapphire. 3D-FDTD simulation reveals a mechanism of enhanced light extraction with various sidewall roughness and thickness in sapphire substrates. Ray tracing simulation examines the light propagation behavior of DUV-FCLED structures. The enhanced output power and higher LEE strongly depends on the sidewall roughness of the sapphire substrate rather than thickness itself. The thickness starts playing a role only when the sapphire sidewalls become rough. The roughened surface of sapphire sidewall during chip-separation process is critical for TM-polarized photons from AlGaN quantum wells to escape in lateral directions before they are absorbed by p-GaN and Au-metal. Furthermore, the ray tracing results show a reasonably good agreement with the experimental result of the LEE.

Strain-effect transistors: Theoretical study on the effects of external strain on III-nitride high-electron-mobility transistors on flexible substrates

This paper presents strain-effect transistors (SETs) based on flexible III-nitride high-electron-mobility transistors (HEMTs) through theoretical calculations. We show that the electronic band structures of InAlGaN/GaN thin-film heterostructures on flexible substrates can be modified by external bending with a high degree of freedom using polarization properties of the polar semiconductor materials. Transfer characteristics of the HEMT devices, including threshold voltage and transconductance, are controlled by varied external strain. Equilibrium 2-dimensional electron gas (2DEG) is enhanced with applied tensile strain by bending the flexible structure with the concave-side down (bend-down condition). 2DEG density is reduced and eventually depleted with increasing compressive strain in bend-up conditions. The operation mode of different HEMT structures changes from depletion- to enchantment-mode or vice versa depending on the type and magnitude of external strain. The results suggest that the operation mo...

Direct periodic patterning of GaN-based light-emitting diodes by three-beam interference laser ablation

We report on the direct patterning of two-dimensional periodic structures in GaN-based light-emitting diodes (LEDs) through laser interference ablation for the fast and reliable fabrication of periodic micro- and nano-structures aimed at enhancing light output. Holes arranged in a two-dimensional hexagonal lattice array having an opening size of 500 nm, depth of 50 nm, and a periodicity of 1 μm were directly formed by three-beam laser interference without photolithography or electron-beam lithography processes. The laser-patterned LEDs exhibit an enhancement in light output power of 20% compared to conventional LEDs having a flat top surface without degradation of electrical and optical properties of the top p-GaN layer and the active region, respectively.

Thin-Film-Flip-Chip LEDs Grown on Si Substrate Using Wafer-Level Chip-Scale Package

Demonstrated are visible GaN-based light-emitting diodes (LEDs) on economical large-area Si substrates using an advanced device and packaging architecture to improve optical output power, while reducing manufacturing costs. The process employs thin-film-flip-chip devices and wafer-level chip-scale packages and uses through-Si-via substrate and anisotropic conductive film for bonding. The improved curvature control region is applied in the epitaxial growth of the LED structure on a Si substrate to achieve flat wafers for epitaxial structures at room temperature, which is critical for wafer-level bonding. External quantum efficiency and light-output power at 350 mA increase by ~12% compared with those of conventional flip-chip LEDs grown on a sapphire substrate. The devices also show a reverse-bias leakage current failure rate of <;10%.

Visible Flip-Chip Light-Emitting Diodes on Flexible Ceramic Substrate With Improved Thermal Management

We demonstrate flip-chip light-emitting diodes (FC-LEDs) on a flexible yttria-stabilized zirconia (YSZ) substrate and compare them with FC-LEDs on a polymeric substrate. Degradation of luminescence intensity and red-shift of peak wavelength are not observed for the LED on the flexible YSZ, unlike one on the polyimide substrate, due to improved capability to remove the generated heat from the chip to the substrate. Thermal distribution measurements and finite-element simulations show improved thermal management by the flexible ceramic as compared with previously developed flexible LEDs on polymeric substrates. The results present an improved solution to high power operation of flexible LEDs.

III-V thin-film photovoltaic solar cells based on single-crystal-like GaAs grown on flexible metal tapes

This paper describes the demonstration of the flexible single-junction III-V solar cells based on high-quality epitaxial GaAs thin films on a low-cost flexible metal substrate. The single-crystal-like semiconductor material structure is fabricated to photovoltaic devices with front illumination geometry. We fabricate a proof-of-concept epitaxial GaAs thin film solar cell with an open-circuit voltage of 0.3 V and short-circuit current of 6 mA/cm2, resulting in conversion efficiency of ~1% in AM1.5G condition. Relatively low efficiency can be further increased by material crystalline quality improvement and device optimization. This development has the potential to open a new avenue for next-generation low-cost and high efficiency flexible PV devices.

AlGaAs/GaAs DH and InGaP/GaAs DH grown by MOCVD on flexible metal substrates

High quality, epitaxial, AlGaAs and InGaP thin films have been grown by metal organic chemical vapor deposition (MOCVD) on flexible metal substrates using buffered GaAs on ion-beam textured epitaxial templates. The grown AlGaAs and InGaP films exhibit strong (001) orientation and sharp in-plane texture. We also report preliminary developments on AlGaAs/GaAs and InGaP/GaAs double heterostructures (DH) to measure minority carrier life-time of GaAs thin films grown using MOCVD. Deposition of undoped AlGaAs was done on flexible GaAs/Ge template with a target Al concentration of 10-40 %, at different growth temperatures (650-800 °C) and 20 Torr process pressure. We have observed minority carrier lifetime of greater than 2 ns for GaAs films grown at 650 °C and sandwiched between Al0.2Ga0.8As DH grown at 750 °C. Deposition of lattice matched updoped In0.48Ga0.52P/GaAs is also in progress. Epitaxial AlGaAs and InGaP can be further utilized in the fabrication of flexible low-cost III-V solar cells on metal substrates.