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Dive into the research topics where Khalid Sirajuddin is active.

Publication


Featured researches published by Khalid Sirajuddin.


Archive | 2008

Post etch reactive plasma milling to smooth through substrate via sidewalls and other deeply etched features

Jon C. Farr; Sharma Pamarthy; Khalid Sirajuddin


Archive | 2009

METHOD AND APPARATUS OF A SUBSTRATE ETCHING SYSTEM AND PROCESS

Sharma Pamarthy; Jon C. Farr; Khalid Sirajuddin; Ezra Robert Gold; James P. Cruse; Scott Olszewski; Roy C. Nangoy; Saravjeet Singh; Douglas A. Buchberger; Jared Ahmad Lee; Chunlei Zhang


Archive | 2012

Methods for etching through-silicon vias with tunable profile angles

Puneet Bajaj; Tong Liu; Khalid Sirajuddin


Archive | 2010

METHOD OF FORMING A DEEP TRENCH IN A SUBSTRATE

Khalid Sirajuddin; Digvijay Raorane; Jon C. Farr; Sharma Pamarthy


Archive | 2010

METHOD OF FILLING A DEEP TRENCH IN A SUBSTRATE

Digvijay Raorane; Khalid Sirajuddin; Jon C. Farr; Sharma Pamarthy


Archive | 2012

METHODS FOR FABRICATING DUAL DAMASCENE INTERCONNECT STRUCTURES

Rohit Mishra; Jayagatan Ram Vijayen; Khalid Sirajuddin; Brad Eaton; Madhava Rao Yalamanchili


Archive | 2016

Edge ring for bevel polymer reduction

Rohit Mishra; Graeme Jamieson Scott; Khalid Sirajuddin; Sheshraj L. Tulshibagwale; Sriskantharajah Thirunavukarasu


Archive | 2014

Wafer Edge Protection and Efficiency Using Inert Gas and Ring

Dung Huu Le; Graeme Jamieson Scott; Jivko Dinev; Madhava Rao Yalamanchili; Khalid Sirajuddin; Puneet Bajaj; Saravjeet Singh


Archive | 2014

METHODS FOR PERFORMING A VIA REVEAL ETCHING PROCESS FOR FORMING THROUGH-SILICON VIAS IN A SUBSTRATE

Rohit Mishra; Khalid Sirajuddin; Madhava Rao Yalamanchili; Sonal A. Srivastava


Archive | 2012

INCREASED DEPOSITION EFFICIENCY AND HIGHER CHAMBER CONDUCTANCE WITH SOURCE POWER INCREASE IN AN INDUCTIVELY COUPLED PLASMA (ICP) CHAMBER

Jivko Dinev; Saravjeet Singh; Khalid Sirajuddin; Tong Liu; Puneet Bajaj; Rohit Mishra; Sonal A. Srivastava; Madhava Rao Yalamanchili; Ajay Kumar

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