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Kimio Yamakawa

Dow Corning

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Publication

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Archive | 2006

PASTY SILVER PARTICLE COMPOSITION, PROCESS FOR PRODUCING SOLID SILVER, SOLID SILVER, JOINING METHOD, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

Kimio Yamakawa; Katsutoshi Mine

Archive | 2000

Semiconductor device comprising silicone adhesive sheet

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa

Archive | 1995

Semiconductor device having a cured silicone coating with non uniformly dispersed filler

Takae Ishikawa; Katsutoshi Mine; Hiroyosi Naito; Kimio Yamakawa

Archive | 2003

Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device

Kimio Yamakawa; Minoru Isshiki; Yoshiko Otani; Katsutoshi Mine

Archive | 2000

Adhesive and semiconductor devices

Kimio Yamakawa; Minoru Isshiki; Katsutoshi Mine

Archive | 1998

Adhesive silicone sheet, method for the preparation thereof and semiconductor devices

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa

Archive | 1996

Thermal conductive silicone rubber composition

Kimio Yamakawa; Noriyasu Yokoyama; Katsutoshi Mine

Archive | 1990

Method of treating a hardened semiconductor resin encapsulated layer with ultraviolet radiation

Katsutoshi Mine; Akemi Kogo; Kimio Yamakawa; Kazumi Nakayoshi

Archive | 1995

Compositions for protecting semiconductor elements and semiconductor devices

Katsutoshi Mine; Hiroyoshi Naito; Kimio Yamakawa

Archive | 1997

Method for curing ultraviolet-curable silicone compositions

Katsutoshi Mine; Hiroyoshi Naito; Kimio Yamakawa

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Collaboration

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Katsutoshi Mine

Dow Corning

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Minoru Isshiki

Dow Corning

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Kazumi Nakayoshi

Dow Corning

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Yoshiko Otani

Dow Corning

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Ryoto Shima

Dow Corning

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Junji Nakanishi

Dow Corning

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Yoshito Ushio

Dow Corning

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Hiroki Ishikawa

Dow Corning

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Hiroyoshi Naito

Dow Corning

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Tomoko Kato

Dow Corning

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