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Yoshiko Otani

Dow Corning

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Publication

Featured researches published by Yoshiko Otani.

Archive | 2000

Semiconductor device comprising silicone adhesive sheet

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa

Archive | 2003

Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device

Kimio Yamakawa; Minoru Isshiki; Yoshiko Otani; Katsutoshi Mine

Archive | 1998

Adhesive silicone sheet, method for the preparation thereof and semiconductor devices

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa

Archive | 2006

Curable silicone composition and electronic part

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa; 実 一色; 淑子 大谷; 君男 山川; 勝利 峰

Archive | 1997

Silicone-based bonding sheet, its production and semiconductor device

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa; 実 一色; 淑子 大谷; 君男 山川; 勝利 峰

Archive | 2000

Semiconductor device having an adhesive and a sealant

Kimio Yamakawa; Minoru Isshiki; Yoshiko Otani; Katsutoshi Mine

Archive | 1998

Silicone adhesive sheet, its manufacture and semiconductor device

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa; 実 一色; 淑子 大谷; 君男 山川; 勝利 峰

Archive | 1998

Hot-melt adhesive sheet and semiconductor devices

Kimio Yamakawa; Minoru Isshiki; Yoshiko Otani; Katsutoshi Mine

Archive | 1998

Silicone-based adhesion sheet

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa; 実 一色; 淑子 大谷; 君男 山川; 勝利 峰

Archive | 1998

Semiconductor bonding and sealing structure

Minoru Isshiki; Katsutoshi Mine; Yoshiko Otani; Kimio Yamakawa

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Collaboration

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Katsutoshi Mine

Dow Corning

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Kimio Yamakawa

Dow Corning

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Minoru Isshiki

Dow Corning

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