Klaus Breitschwerdt

Method of etching structures into an etching body using a plasma

Module, especially a wafer module

Processing silicon@ wafer having deformable micro mechanical structure - comprising adhering foil to lower side of wafer and removing foil after processing

Device and method for anisotropic plasma etching of a substrate, a silicon body in particular

Device and method for anisotropically plasma etching of a substrate, particularly a silicon body

Electrical system, especially a microelectronic or microelectromechanical high frequency system

Verfahren zum Einätzen von Strukturen in einem Ätzkörper mit einem Plasma

Inductively-coupled plasma-etching equipment for silicon substrates includes two stacked coils producing field between substrate and ICP source

Method and device for providing a semiconductor etching end point and for detecting the end point

Layer and system with a silicon layer and a passivation layer, method for production of a passivation layer on a silicon layer and use thereof