Kohei Suda

Multi-layered MoS2 film formed by high-temperature sputtering for enhancement-mode nMOSFETs

A multi-layered MoS2 film was formed on a SiO2 film by high-temperature sputtering, which is one of the alternative methods of Si LSI technology. It was found that the carrier density of a sputter-deposited MoS2 film is 1000 times smaller than that of an exfoliated one. By sputtering, two different orientations, namely a layer lateral to a SiO2/Si substrate and a layer perpendicular to the substrate, were formed. The lateral layer showed a lower carrier density than the perpendicular layer because of the decrease in the number of sulfur vacancies, as commonly discussed in several research studies. However, the vacancies are not sufficient for describing this significant reduction in carrier density. It is considered that a sodium ion functioning as an interface trapped charge is one of the main origins of carriers. Sputtering, which enables us to determine the sodium contamination level, can be seen as appropriate for reducing the carrier density; hence, this method is considered to be efficient in realizing enhancement-mode MoS2 MOSFETs. In addition, sputtering also enable us to form large-scale MoS2 films up to a wafer size. Therefore, a sputter-deposited MoS2 film is a promising material for post-silicon devices.

Improving crystalline quality of sputtering-deposited MoS2 thin film by postdeposition sulfurization annealing using (t-C4H9)2S2

A sputtered MoS2 thin film is a candidate for realizing enhancement-mode MoS2 metal–oxide–semiconductor field-effect transistors (MOSFETs). However, there are some sulfur vacancies in the film, which degrade the device performance. In this study, we performed postdeposition sulfurization annealing (PSA) on a sputtered MoS2 thin film in order to complement sulfur vacancies, and we investigated the fundamental properties of the MoS2 film. As a result, a high-quality crystalline 10-layer MoS2 film with an ideal stoichiometric composition was obtained at a relatively low process temperature (500 °C). The MoS2 film had an indirect bandgap of 1.36 eV and a high Hall mobility compared with the as-deposited sputtered MoS2 film.

Properties of single-layer MoS2 film fabricated by combination of sputtering deposition and post deposition sulfurization annealing using (t-C4H9)2S2

The fabrication of a high-quality single-layer MoS2 film was achieved at a sufficiently low temperature of 500 °C by the combination of sputtering deposition and post deposition sulfurization annealing. Fabrication only by sputtering produces unintentionally sulfur-deficient nonstoichiometric films with poor crystalline quality in nature, making it difficult to fabricate atomically thin sputtered MoS2 films, especially with a single layer. From the results of the sulfurization annealing, sulfur deficiencies in the film were fully complemented and the crystalline quality, especially in-plane symmetry, was dramatically improved. The quasi-layered structure of the sputtered-MoS2 film led to the success in achieving low-temperature sulfurization annealing. Moreover, the film had large area uniformity, accurate thickness controllability, a direct bandgap of 1.86 eV, and an extremely high visible transmittance of more than 97%. Therefore, we consider that the fabrication technique will contribute to realizing MoS2 display applications such as a low-power-consumption thin-film-transistor liquid crystal display.

Ge homoepitaxial growth by metal–organic chemical vapor deposition using t-C4H9GeH3

We succeeded in growing Ge homoepitaxial films by metal–organic chemical vapor deposition (MOCVD) using tertiarybutylgermane (t-C4H9GeH3). We synthesized and investigated the characteristics of t-C4H9GeH3. The vapor pressure was sufficiently high in the CVD process. The precursor was sufficiently safe as it did not have a pyrophoric and explosive nature. The Ge homoepitaxial growth was achieved at 360 °C under reduced pressure on an appropriately cleaned Ge(001) substrate.

Biaxial stress evaluation in GeSn film epitaxially grown on Ge substrate by oil-immersion Raman spectroscopy

GeSn is being paid much attention as a next-generation channel material. In this work, we performed the excitation of forbidden transverse optical (TO) phonons from strained GeSn, as well as longitudinal optical (LO) phonons, under the backscattering geometry from the (001) surface by oil-immersion Raman spectroscopy. Using the obtained LO/TO phonons, we derived the phonon deformation potentials (PDPs), which play an important role in the stress evaluation, of the strained Ge1− x Sn x for the first time. The results suggest that PDPs are almost constant for the Ge1− x Sn x (x < 0.032). Biaxial stress calculated using the derived PDPs reasonably indicated the isotropic states.

Ge2Sb2Te5 Film Fabrication by Tellurization of Chemical Vapor Deposited GeSb

This paper describes stoichiometric Ge2Sb2Te5 (GST) film fabrication by the process based on chemical vapor deposition (CVD). GST films were fabricated by tellurization after GeSb CVD. This two step process enabled to fill high aspect holes. By applying appropriate precursors and process temperature, the surface morphology of the GST film was significantly improved. The moderate tellurization reaction process might contribute GST formation with maintaining the amorphous structure of the CVD GeSb. We believe this technique is useful for phase change memory application.