Ryo Yokogawa

Biaxial stress evaluation in GeSn film epitaxially grown on Ge substrate by oil-immersion Raman spectroscopy

GeSn is being paid much attention as a next-generation channel material. In this work, we performed the excitation of forbidden transverse optical (TO) phonons from strained GeSn, as well as longitudinal optical (LO) phonons, under the backscattering geometry from the (001) surface by oil-immersion Raman spectroscopy. Using the obtained LO/TO phonons, we derived the phonon deformation potentials (PDPs), which play an important role in the stress evaluation, of the strained Ge1− x Sn x for the first time. The results suggest that PDPs are almost constant for the Ge1− x Sn x (x < 0.032). Biaxial stress calculated using the derived PDPs reasonably indicated the isotropic states.

Origin of additional broad peaks in Raman spectra from thin germanium-rich silicon–germanium films

Additional broad peaks in Raman spectra from thin Ge-rich SiGe films were examined in detail. The broad peak on the low-wavenumber side of first-order optical phonon was also present for pure Ge, which indicates that the localized mode is not the reason for the broad peaks. Furthermore, other factors, e.g., strain, defect, phonon confinement effect, Fano effect, and fluorescence from oil, were excluded from the origin of the broad peaks. We assigned the broad peaks to surface optical phonon modes. The dependence of this surface mode on Ge concentration in Ge-rich SiGe was also investigated and the behavior was discussed.

Evaluation of controlled strain in silicon nanowire by UV Raman spectroscopy

The evaluation of strain states in silicon nanowires (Si NWs) is important not only for the surrounding gate field-effect transistors but also for the thermoelectric Si NW devices to optimize their electric and thermoelectric performance characteristics. The strain states in Si NWs formed by different oxidation processes were evaluated by UV Raman spectroscopy. We confirmed that a higher tensile strain was induced by the partial presence of a tetraethyl orthosilicate (TEOS) SiO2 layer prior to the thermal oxidation. Furthermore, in order to measure biaxial stress states in Si NWs accurately, we performed water-immersion Raman spectroscopy. It was confirmed that the anisotropic biaxial stresses in the Si NWs along the length and width directions were compressive and tensile states, respectively. The Si NW with a TEOS SiO2 layer on top had a larger strain than the Si NW surrounded only by thermal SiO2.

Miniaturized planar Si-nanowire micro-thermoelectric generator using exuded thermal field for power generation

Abstract For harvesting energy from waste heat, the power generation densities and fabrication costs of thermoelectric generators (TEGs) are considered more important than their conversion efficiency because waste heat energy is essentially obtained free of charge. In this study, we propose a miniaturized planar Si-nanowire micro-thermoelectric generator (SiNW-μTEG) architecture, which could be simply fabricated using the complementary metal–oxide–semiconductor–compatible process. Compared with the conventional nanowire μTEGs, this SiNW-μTEG features the use of an exuded thermal field for power generation. Thus, there is no need to etch away the substrate to form suspended SiNWs, which leads to a low fabrication cost and well-protected SiNWs. We experimentally demonstrate that the power generation density of the SiNW-μTEGs was enhanced by four orders of magnitude when the SiNWs were shortened from 280 to 8 μm. Furthermore, we reduced the parasitic thermal resistance, which becomes significant in the shortened SiNW-μTEGs, by optimizing the fabrication process of AlN films as a thermally conductive layer. As a result, the power generation density of the SiNW-μTEGs was enhanced by an order of magnitude for reactive sputtering as compared to non-reactive sputtering process. A power density of 27.9 nW/cm2 has been achieved. By measuring the thermal conductivities of the two AlN films, we found that the reduction in the parasitic thermal resistance was caused by an increase in the thermal conductivity of the AlN film and a decrease in the thermal boundary resistance.

Evaluation of Anisotropic Biaxial Stress Induced Around Trench Gate of Si Power Transistor Using Water-Immersion Raman Spectroscopy

The trench gate structure is one of the promising techniques to reduce on-state resistance (Ron) for silicon power devices, such as insulated gate bipolar transistors and power metal–oxide–semiconductor field-effect transistors. In addition, it has been reported that stress is induced around the trench gate area, modifying the carrier mobilities. We evaluated the one-dimensional distribution and anisotropic biaxial stress by quasi-line excitation and water-immersion Raman spectroscopy, respectively. The results clearly confirmed anisotropic biaxial stress in state-of-the-art silicon power devices. It is theoretically possible to estimate carrier mobility using piezoresistance coefficients and anisotropic biaxial stress. The electron mobility was increased while the hole mobility was decreased or remained almost unchanged in the silicon (Si) power device. The stress significantly modifies the Ron of silicon power transistors. Therefore, their performance can be improved using the stress around the trench gate.

Probing spatial heterogeneity in silicon thin films by Raman spectroscopy

Raman spectroscopy is a powerful technique for revealing spatial heterogeneity in solid-state structures but heretofore has not been able to measure spectra from multiple positions on a sample within a short time. Here, we report a novel Raman spectroscopy approach to study the spatial heterogeneity in thermally annealed amorphous silicon (a-Si) thin films. Raman spectroscopy employs both a galvano-mirror and a two-dimensional charge-coupled device detector system, which can measure spectra at 200 nm intervals at every position along a sample in a short time. We analyzed thermally annealed a-Si thin films with different film thicknesses. The experimental results suggest a correlation between the distribution of the average nanocrystal size over different spatial regions and the thickness of the thermally annealed a-Si thin film. The ability to evaluate the average size of the Si nanocrystals through rapid data acquisition is expected to lead to research into new applications of nanocrystals.

Enhanced nickelidation rate in silicon nanowires with interfacial lattice disorder

We demonstrate that the nickelidation (nickel silicidation) reaction rate of silicon nanowires (SiNWs) surrounded by a thermally grown silicon dioxide (SiO2) film is enhanced by post-oxidation annealing (POA). The SiNWs are fabricated by electron beam lithography, and some of the SiNWs are subjected to the POA process. The nickelidation reaction rate of the SiNWs is enhanced in the samples subjected to the POA treatment. Ultraviolet Raman spectroscopy measurements reveal that POA enhances compressive strain and lattice disorder in the SiNWs. By considering these experimental results in conjunction with our molecular dynamics simulation analysis, we conclude that the oxide-induced lattice disorder is the dominant origin of the increase in the nickelidation rate in smaller width SiNWs. This study sheds light on the pivotal role of lattice disorders in controlling metallic contact formation in SiNW devices.