Koya Arai
Tokyo University of Science
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Featured researches published by Koya Arai.
Key Engineering Materials | 2011
Koya Arai; Hiroyuki Akimoto; Tohru Kineri; Tsutomu Iida; Keishi Nishio
NaCo2O4 and 0.5at%-Sb doped Mg2Si have excellent thermoelectric properties. We tried to fabricate a thermoelectric module composed of these materials and using Ni plates as electrodes. The fine powder of NaCo2O4 was prepared by metal-citric acid complex decomposition. 0.5at%-Sb doped Mg2Si bulk was ground to powder and sieved to a powder particle size of 75 micrometers or less. These powders were sintered using spark plasma sintering (SPS) to obtain a body of NaCo2O4 and 0.5at%-Sb doped Mg2Si. These thermoelectric materials were connected to the Ni plates by using the SPS method. The whole process took a very short time (less than 2 min) and could be done at low temperature (below 873 K). The open-circuit voltagevalues were 82.7 mV, and the maxima, maximum output current and maximum output power, for the single module were 212.4 mA and 6.65 mW at ΔT = 470 K.
9TH EUROPEAN CONFERENCE ON THERMOELECTRICS: ECT2011 | 2012
Keishi Nishio; Yukie Sawada; Koya Arai; Tatsuya Sakamoto; Yasuo Kogo; Tsutomu Iida
Thermoelectric (TE) modules with a π structure were fabricated by the spark plasma sintering method. The modules were composed of SrRuO3 for the p-type semiconductor, Mg2Si for the n-type semiconductor, and Ni for the electrodes. The SrRuO3 powder was synthesized using the metal-citric-acid complex decomposition method. Mg2Si bulk prepared by meltquenching was ground into powder and sieved to a particle size of 75 μm or less. To obtain the sintered body of SrRuO3, the powder was sintered using spark plasma sintering (SPS). For SPS, the precursor powder was placed in a graphite die and kept at that temperature under a uni-axial pressure of 50 MPa and in vacuum conditions (less than 7 Pa). After sintering by SPS, the ceramic sample was annealed at 1573K in air because the SrRuO3 was slightly reduced during the SPS process in the graphite die. These TE sintered bodies were cut and polished. The dimensions of the samples used for fabrication of the p-type parts of the TE modules were 4.50×9.50×7.45 mm3 and those for the n-type parts were 5.50×11.45×7.45 mm3. Pressed Ni powder was put between these TE materials and the Ni electrodes in order to connect them together, and electrical power was passed through the electrodes from the SPS equipment. The output power under temperature differences ΔT ranging from 100 to 500 K was measured. The open-circuit voltage, maximum output current and maximum output power increased with increasing temperature difference ΔT. The open-circuit voltage of the single module was 91.0 mV, and the maximum output current and maximum output power were 5000 mA and 110 mW at ΔT=500 K, respectively.Thermoelectric (TE) modules with a π structure were fabricated by the spark plasma sintering method. The modules were composed of SrRuO3 for the p-type semiconductor, Mg2Si for the n-type semiconductor, and Ni for the electrodes. The SrRuO3 powder was synthesized using the metal-citric-acid complex decomposition method. Mg2Si bulk prepared by meltquenching was ground into powder and sieved to a particle size of 75 μm or less. To obtain the sintered body of SrRuO3, the powder was sintered using spark plasma sintering (SPS). For SPS, the precursor powder was placed in a graphite die and kept at that temperature under a uni-axial pressure of 50 MPa and in vacuum conditions (less than 7 Pa). After sintering by SPS, the ceramic sample was annealed at 1573K in air because the SrRuO3 was slightly reduced during the SPS process in the graphite die. These TE sintered bodies were cut and polished. The dimensions of the samples used for fabrication of the p-type parts of the TE modules were 4.50×9.50×7.45 mm3 and th...
Journal of Electronic Materials | 2012
Koya Arai; Masanori Matsubara; Yukie Sawada; Tatsuya Sakamoto; Tohru Kineri; Yasuo Kogo; Tsutomu Iida; Keishi Nishio
Journal of Electronic Materials | 2014
Tatsuya Sakamoto; Tsutomu Iida; Yota Ohno; Masashi Ishikawa; Yasuo Kogo; Naomi Hirayama; Koya Arai; Takashi Nakamura; Keishi Nishio; Yoshifumi Takanashi
Journal of Electronic Materials | 2015
Tomoyuki Nakamura; Kazuya Hatakeyama; Masahiro Minowa; Youhiko Mito; Koya Arai; Tsutomu Iida; Keishi Nishio
Materials Science and Engineering B-advanced Functional Solid-state Materials | 2015
Koya Arai; Asumi Sasaki; Yuto Kimori; Miharu Iida; Tomoyuki Nakamura; Yuki Yamaguchi; Kenjiro Fujimoto; Ryuji Tamura; Tsutomu Iida; Keishi Nishio
MRS Proceedings | 2013
Koya Arai; Keishi Nishio; Norifumi Miyamoto; Kota Sunohara; Tatsuya Sakamoto; Hiroshi Hyodo; Naomi Hirayama; Yasuo Kogo; Tsutomu Iida
MRS Proceedings | 2013
Tomoyuki Nakamura; Kazuya Hatakeyama; Masahiro Minowa; Youhiko Mito; Koya Arai; Tsutomu Iida; Keishi Nishio
MRS Proceedings | 2013
Natsuko Mikami; Keishi Nishio; Koya Arai; Tatsuya Sakamoto; Masahiro Minowa; Tomoyuki Nakamura; Naomi Hirayama; Yasuo Kogo; Tsutomu Iida
MRS Proceedings | 2015
Kota Sunohara; Koya Arai; Tomoyuki Nakamura; Kenjiro Fujimoto; Yuki Yamaguchi; Tsutomu Iida; Keishi Nishio