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Dive into the research topics where Kristof Dhaenens is active.

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Featured researches published by Kristof Dhaenens.


Eurasip Journal on Wireless Communications and Networking | 2011

In-body path loss models for implants in heterogeneous human tissues using implantable slot dipole conformal flexible antennas

Divya Kurup; Maria Lucia Scarpello; Günter Vermeeren; Wout Joseph; Kristof Dhaenens; Fabrice Axisa; Luc Martens; Dries Vande Ginste; Hendrik Rogier; Jan Vanfleteren

A wireless body area network (WBAN) consists of a wireless network with devices placed close to, attached on, or implanted into the human body. Wireless communication within a human body experiences loss in the form of attenuation and absorption. A path loss model is necessary to account for these losses. In this article, path loss is studied in the heterogeneous anatomical model of a 6-year male child from the Virtual Family using an implantable slot dipole conformal flexible antenna and an in-body path loss model is proposed at 2.45 GHz with application to implants in a human body. The model is based on 3D electromagnetic simulations and is compared to models in a homogeneous muscle tissue medium.


Bio-medical Materials and Engineering | 2014

Fabrication and functionalization of PCB gold electrodes suitable for DNA-based electrochemical sensing.

Pietro Salvo; O.Y.F. Henry; Kristof Dhaenens; J.L. Acero Sánchez; An Gielen; B. Werne Solnestam; Joakim Lundeberg; Ciara K. O'Sullivan; Jan Vanfleteren

The request of high specificity and selectivity sensors suitable for mass production is a constant demand in medical research. For applications in point-of-care diagnostics and therapy, there is a high demand for low cost and rapid sensing platforms. This paper describes the fabrication and functionalization of gold electrodes arrays for the detection of deoxyribonucleic acid (DNA) in printed circuit board (PCB) technology. The process can be implemented to produce efficiently a large number of biosensors. We report an electrolytic plating procedure to fabricate low-density gold microarrays on PCB suitable for electrochemical DNA detection in research fields such as cancer diagnostics or pharmacogenetics, where biosensors are usually targeted to detect a small number of genes. PCB technology allows producing high precision, fast and low cost microelectrodes. The surface of the microarray is functionalized with self-assembled monolayers of mercaptoundodecanoic acid or thiolated DNA. The PCB microarray is tested by cyclic voltammetry in presence of 5 mM of the redox probe K3Fe(CN6) in 0.1 M KCl. The voltammograms prove the correct immobilization of both the alkanethiol systems. The sensor is tested for detecting relevant markers for breast cancer. Results for 5 nM of the target TACSTD1 against the complementary TACSTD1 and non-complementary GRP, MYC, SCGB2A1, SCGB2A2, TOP2A probes show a remarkable detection limit of 0.05 nM and a high specificity.


2012 4th Electronic System-Integration Technology Conference | 2012

An approach to produce a stack of photo definable polyimide based flat UTCPs

S. Priyabadini; T. Sterken; Liang Wang; Kristof Dhaenens; Bjorn Vandecasteele; S. Van Put; A.E. Petersen; Jan Vanfleteren

Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects.


Advanced Engineering Materials | 2017

Arbitrarily Shaped 2.5D Circuits using Stretchable Interconnects Embedded in Thermoplastic Polymers

Bart Plovie; Yang Yang; Joren Guillaume; Sheila Dunphy; Kristof Dhaenens; Steven Van Put; Bjorn Vandecasteele; Thomas Vervust; Frederick Bossuyt; Jan Vanfleteren


International Symposium on Microelectronics, Proceedings | 2015

2.5D Smart Objects Using Thermoplastic Stretchable Interconnects

Bart Plovie; Sheila Dunphy; Kristof Dhaenens; Steven Van Put; Bjorn Vandecasteele; Frederick Bossuyt; Jan Vanfleteren


45th International symposium on Microelectronics (IMAPS 2012) : Bringing together the entire microelectronics supply chain! | 2012

High-yield embedding of 30µm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)

Tom Sterken; Maaike Op de Beeck; Filip Vermeiren; Tom Torfs; Liang Wang; Swarnakamal Priyabadini; Kristof Dhaenens; Dieter Cuypers; Jan Vanfleteren


44th International Symposium on Microelectronics (IMAPS - 2011) | 2011

3D-stacking of UTCPs as a module miniaturization technology

Swarnakamal Priyabadini; An Gielen; Kristof Dhaenens; Wim Christiaens; S. Van Put; G. Kunkel; A.E. Petersen; Jan Vanfleteren


Microwave and Optical Technology Letters | 2007

Flexible‐substrate low‐cost construction of a coplanar‐waveguide aperture‐coupled microstrip patch antenna

Dominic Depret; Hendrik Rogier; Kristof Dhaenens; Jan Vanfleteren


Advanced electronic materials | 2018

3D Multifunctional Composites Based on Large-Area Stretchable Circuit with Thermoforming Technology

Yang Yang; Thomas Vervust; Sheila Dunphy; Steven Van Put; Bjorn Vandecasteele; Kristof Dhaenens; Lieven Degrendele; Lothar Mader; Linde De Vriese; Tom Martens; Markus Kaufmann; Tsuyoshi Sekitani; Jan Vanfleteren


international microsystems, packaging, assembly and circuits technology conference | 2016

One-time deformable thermoplastic devices based on flexible circuit board technology

Bart Plovie; Yang Yang; Joren Guillaume; Sheila Dunphy; Kristof Dhaenens; Steven Van Put; Thomas Vervust; Frederick Bossuyt; Jan Vanfleteren

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