Frederick Bossuyt

A Novel Interconnect Design with High Stretchability and Fine Pitch Capability for Applications in Stretchable Electronics

In this paper, the electromechanical properties of a new design for metal interconnection in stretchable electronics are reported. In this design, a patterned metal interconnect with a zigzag shape is adhered on an elastomeric substrate. The electrical resistance remains constant until metal breakdown at elongations beyond 40%. There is no significant local necking in either the transverse or the thickness direction at the metal breakdown area as shown by both scanning electron microscopy micrographs and resistance measurements. Micrographs and simulation results show that a debonding occurs due to the local twisting of a metal interconnect, out-of-plane peeling and strain localized at the crest of a zigzag structure.