Kunihiro Miyazaki

Total reflection x-ray fluorescence spectroscopy using synchrotron radiation for wafer surface trace impurity analysis (invited)

Trace impurity analysis is essential for the development of competitive silicon circuit technologies. Current best methods for chemically identifying and quantifying surface and near‐surface impurities include grazing incidence x‐ray fluorescence techniques using rotating anode x‐ray sources. To date, this method falls short of what is needed for future process generations. However, the work described here demonstrates that with the use of synchrotron radiation, total reflection x‐ray fluorescence methods can be extended to meet projected needs of the silicon circuit industry until, at least, the year 2000. The present results represent over an order of magnitude improvement in detection limit over what has been reported previously. A double multilayer monochromator on a high flux wiggler beam line resulted in a detection limit for Ni of 3×108 atoms/cm2. This is to be compared with a detection limit of 5×109 atoms/cm2 obtained with a rotating anode system. This is due to the greatly improved signal to bac...

The Influence Of Native Oxide On Si Wafer Cleaning

A method has been developed for removing metallic contaminataminants such as Cu which have a lower ionization tendency than Si and easily adhere Si surfaces in HF solution. Copper removal by a mixture. of acids and hydrogen peroxide can be described in terms of a corrosion model based on the pH-electrochemical potential diagram. This model suggests that HCl/H202 and HF/H202 sholuld remove Cu contaminants from Si surfaces. However for these solutions, the Cu removal efficiency is affected by the growth of native oxide before cleaning.