Fumio Komatsu

An electron beam test system linked with a CAD database

In this paper, the advantages of shorter setup time and ease of operation achieved by linking a CAD system to an electron beam test system are presented. More specifically, by referring to mask pattern data in a CAD database, automatic positioning can be achieved within an accuracy of 0.25 @mm to match any designated target position specified on the terminal screen. In addition, automatic generation of a circuit test vector can be realized with a significant decrease in the required setup time.

High-accuracy development monitoring technology

A development monitor system capable of highly accurate control of pattern width has been established. This system is composed of a unique monitor pattern on the process wafer, the 0th order diffraction light measuring unit, and the image analysis and process control unit. In the conventional development process in which no monitor system is employed, the CD variation in 200nm line width was about 15nm when +/- 5 percent dose error exist. However, using the new system, 1nm of CD variation was obtained. In this article, a high-sensitivity monitor pattern is proposed and its performance in controlling 200nm line and space patterns in the development process is reported.