Kyoung-Hwan Kim

Robust pad layout to improve wire bonding reliability

Different from the conventional study to improve the pad reliability against the peel-off, this study focuses on the probability that the peel-off could be originated from the perpendicular pushing down mechanical stress (PPMS) during the ball mounting process. Suggested in this paper are a new model which causes the peel-off and a new pad structure that overcomes the pad peel-off without any special procedures or changes in material or dimension. Three sets of layout patterns have been designed and fabricated in a 0.13 µm CMOS process. To assess the wire bonding quality, wire pulling tests (WPT) and evaluation of bonding power dependencies by means of wedge wire bonding are conducted. Additionally, FAMMOS simulator is adopted to verify the newly proposed pad structure.

Robust single chip on screen display for home VCRs

This paper describes the design of a robust on-screen-display (OSD) chip with improved automatic frequency control (AFC). The built-in AFC reduces the amount of sync jitter caused by the VCR head switching pulse, video copy guard signals, etc. This chip contains the OSD circuitry which can display characters of up to 12 rows by 30 columns on display systems. The character colors can be changed by programming the content of an 8-bit control register through the serial interface. It also provides the functions of half tone, box drawing, scroll, and blink. The chip was fabricated by using a 0.65 /spl mu/m double metal CMOS process.