Kyoung-Won Kim

Fabrication and Characterization of Ru Thin Films Prepared by Liquid Delivery Metal-Organic Chemical Vapor Deposition

Ruthenium thin film was obtained by the liquid delivery metal organic chemical vapor deposition method using a new Ru(C8H13O2)3 precursor for the advanced capacitor electrode in Gbit-scale dynamic random access memory. Deposition was done on a TiN barrier layer in the range of 250–400°C. The thin film characterization was performed in terms of the resistivity, change of crystal structure, surface morphology, microstructure and film purity. The resistivity depended on the impurity, grain shape and crystalline structure of the film. The minimum resistivity of 13.9 µΩcm was obtained at 400°C. The X-ray diffraction and X-ray photoelectron spectroscopy results indicate that the RuO2 phase and the silicidation are not observed and are independent of the deposition temperature. The carbon and hydrogen contaminants in the Ru film were shown to disturb the crystal preferred orientation growth. The Ru film was found to grow perpendicular to the substrate and to be the columnar structure.

Effect of Channel Length in LDMOSFET on the Switching Characteristic of CMOS Inverter

A two-dimensional TCAD MEDICI simulator was used to examine the voltage transfer characteristics, on-off switching properties and latch-up of a CMOS inverter as a function of the n-channel length and doping levels. The channel in a LDMOSFET encloses a junction-type source and is believed to be an important parameter for determining the circuit operation of a CMOS inverter. The digital logic levels of the output and input voltages were analyzed from the transfer curves and circuit operation. The high and low logic levels of the input voltage showed a strong dependency on the channel length, while the lateral substrate resistance from a latch-up path in the CMOS inverter was comparable to that of a typical CMOS inverter with a guard ring.

Electrical Characteristics of CMOS Circuit Due to Channel Region Parameters in LDMOSFET

The electrical characteristics of CMOS inverter with LDMOSFET are studied for high power and digital circuit application by using two dimensional MEDICI simulator. The simulation is done in terms of voltage transfer characteristic and on-off switching properties of CMOS inverter with variation of channel length and channel doping levels. The channel which surrounds a junction-type source in LDMOSFET is considered to be an important parameter to decide a circuit operation of CMOS inverter. The digital logic levels of input voltage show to increase with increase of n-channel length and doping levels while the logic output levels show to the almost constant.

Preparation and characterization of RuOx thin films by liquid delivery metalorganic chemical vapor deposition

RuOx films were deposited by liquid delivery metalorganic chemical vapor deposition method using a new Ru(C8H13O2)3 precursor for the advanced capacitor electrode in Gbit-scale dynamic random access memory. Deposition was carried out on a TiN barrier layer in the range of 250–400°C and the ratio of the O2 flow rate to the total flow rate of Ar and O2 was varied from 20 to 80%. RuOx thin films were annealed at 650°C for 1 min with Ar, N2 or NH3 ambient. Film characterization was performed in terms of resistivity, crystal structure, surface morphology, microstructure and film purity. The resistivity depended on the impurity, grain density and crystalline structure of the film. The oxygen used to form Ru the oxide was found to eliminate the carbon and hydrogen elements in an organic source. The O2 flow ratio that changes the crystal structure of the films from Ru to RuO2 was found to be 40%. The metallic Ru phase forming a RuO2/Ru bilayer at the RuO2/TiN interface was observed at O2 flow ratios of 50% and 60%. The X-ray diffraction results indicate that the RuO2 phase and the silicidation are not observed regardless of the ambient gases. Ar was more effective than N2 and NH3 as an ambient gas for the postannealing of the Ru films.

Vertical Augmentation of Maxillary Posterior Alveolar Ridge Using Allogenic Block Bone Graft and Simultaneous Maxillary Sinus Graft.

The maxillary posterior area is the most challenging site for the dental implant. Although the sinus graft is a predictable and successful technique for rehabilitation of atrophic and pneumatized posterior maxilla, when there is severe destruction of alveolar bone, a very long crown length remains challenging after successful dental implants installation with sinus graft. We performed vertical augmentation of the maxillary posterior alveolar ridge using the allogenic block bone graft with a simultaneous sinus graft using allogenic and heterogenic bone chips. After about six months, we installed the dental implant. After this procedure, we achieved a more favorable crown-implant fixture ratio and better results clinically and biomechanically. This is a preliminary report of vertical augmentation of maxillary posterior alveolar ridge using allogenic block bone graft and simultaneous maxillary sinus graft. Further research requires longer observation and more patients.

An 8b Two-stage Folding A/D Converter with Low DNL

In this research, a 8-bit CMOS 2 stage folding A/D converter is designed, For low power consumption and small chip size, the A/D converter is designed by using folding and interpolation circuit. Folding circuit is composed of the transistor differential pairs which are connected in parallel. It reduces the number of comparator drastically. The analog block composed of folding block, current interpolation circuit, and three stage current comparator is designed with differential-mode for high speed operation. The simulation in a CMOS process. shows DNL and SNDR of 0.5LSB and 47 dB at 250 MHz/s sampling frequency.

Electrical Characteristics of the Dual Gate Emitter Switched Thyristor

Two dimensional MEDICI simulator is used to study the electrical characteristics of Dual Gate Emitter Switched Thyristor. The simulation is done in terms of the current-voltage characteristics with the variations of p-base impurity concentrations and current flow. Compared with the other power devices such as MOS Controlled Cascade Thyristor(MCCT), Conventional Emitter Switched Thyristor(C-EST) and Dual Channel Emitter Switched Thyristor(DC-EST), Dual Gate Emitter Switched Thyristor(DG-EST) shows to have tile better electrical characteristics, which is the high latch-up current density and low forward voltage-drop. The proposed DG-EST which has a non-planer u-base structure under the floating N+ emitter indicates to have the better characteristics of latch-up current and breakover voltage in spite of the same turn-off characteristics.