KyungHoon Lee | Researchain

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Archive | 2008

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

OhHan Kim; Sunmi Kim; KyungHoon Lee

Archive | 2014

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Sun Mi Kim; OhHan Kim; KyungHoon Lee

Archive | 2013

Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material

Daesik Choi; Sang Mi Park; KyungHoon Lee

Archive | 2011

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MANUFACTURE THEREOF

KyungHoon Lee; DaeWook Yang; Sunmi Kim

Archive | 2013

Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material

KyungHoon Lee; KiYoun Jang; JoonDong Kim

Archive | 2011

Semiconductor Device and Method of Forming Conductive Protrusions Over Conductive Pillars or Bond Pads as Fixed Offset Vertical Interconnect Structures

Jaehyun Lee; KyungHoon Lee; Seongwon Park; KiYoun Jang

Archive | 2010

Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die

KyungHoon Lee; Soo Moon Park; Seung Won Kim

Archive | 2013

Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure

KyungHoon Lee; Hyunjin Song; KyoungIl Huh; Daesik Choi

Archive | 2011

Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance

KyungHoon Lee; Seongwon Park; KiYoun Jang; Jaehyun Lee

Archive | 2013

Semiconductor Device and Method of Using Partial Wafer Singulation for Improved Wafer Level Embedded System in Package

KyungHoon Lee; SangMi Park; KyoungIl Huh; Daesik Choi

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