KyungHoon Lee

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material

Semiconductor Device and Method of Forming Conductive Protrusions Over Conductive Pillars or Bond Pads as Fixed Offset Vertical Interconnect Structures

Semiconductor device and method of forming uniform height insulating layer over interposer frame as standoff for semiconductor die

Semiconductor device and method of forming WLCSP with semiconductor die embedded within interconnect structure

Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance

Semiconductor Device and Method of Using Partial Wafer Singulation for Improved Wafer Level Embedded System in Package