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Dive into the research topics where KyuWon Lee is active.

Publication


Featured researches published by KyuWon Lee.


Archive | 2010

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

Daesik Choi; Taewoo Lee; KyuWon Lee; SungWon Cho


Archive | 2008

Integrated circuit package stacking system

JiHoon Oh; JinGwan Kim; Jaehyun Lim; SunYoung Chun; KyuWon Lee; SinJae Lee; JongVin Park


Archive | 2008

Package-on-package system with heat spreader

JiHoon Oh; KyuWon Lee; Jaehyun Lim; JongVin Park; SinJae Lee


Archive | 2012

Semiconductor Device and Method of Forming WLCSP Structure Using Protruded MLP

OhHan Kim; SungWon Cho; Daesik Choi; KyuWon Lee; DongSoo Moo


Archive | 2013

Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die Disposed in a Cavity of an Interconnect Structure and Grounded Through the Die TSV

SinJae Lee; JinGwan Kim; JiHoon Oh; Jaehyun Lim; KyuWon Lee


Archive | 2013

Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape

SungWon Cho; Taewoo Lee; Daesik Choi; KyuWon Lee


Archive | 2013

Semiconductor Device and Method of Forming Partially-Etched Conductive Layer Recessed Within Substrate for Bonding to Semiconductor Die

KyuWon Lee; HyunSu Shin; Hun Jeong; JinGwan Kim; SunYoung Chun


Archive | 2012

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CONDUCTIVE STRUCTURE AND METHOD OF MANUFACTURE THEREOF

JinGwan Kim; KyuWon Lee; JiHoon Oh; JongVin Park


Archive | 2013

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF

Daesik Choi; Taewoo Lee; KyuWon Lee; SungWon Cho


Archive | 2010

Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

KyuWon Lee; HyunSu Shin; Hun Jeong; JinGwan Kim; SunYoung Chun

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