SungWon Cho

Integrated circuit packaging system with vertical interconnection and method of manufacture thereof

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

Semiconductor Device and Method of Forming WLCSP Structure Using Protruded MLP

Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate

Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump

Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape

Semiconductor Device and Method of Forming Bump Structure with Insulating Buffer Layer to Reduce Stress on Semiconductor Wafer

Semiconductor Device and Method of Forming Column Interconnect Structure to Reduce Wafer Stress

Integrated circuit packaging system with rounded interconnect

Semiconductor Device and Method of Forming POP With Stacked Semiconductor Die and Bumps Formed Directly on the Lower Die