Lan-Tian Feng

On-Chip Multiplexed Multiple Entanglement Sources in a Single Silicon Nanowire

Silicon-on-chip (SOI) photonic circuit is the most promising platform for scalable quantum information technology for its low loss, small footprint, CMOS-compatible and telecom communications techniques compatible. Multiple multiplexed entanglement sources include: energy-time, time-bin and polarization entangled sources based on 1-cm length single silicon nanowire, all these sources are compatible with (100GHz) dense-wave-division-multiplexing (DWDM) system. Different methods such as two photon interference pattern, Bell-Inequality and quantum state tomography are used to characterize the quality of these entangled sources. Multiple entanglements are generated over more than 5 channel pairs with high raw (net) visibilities around 97% (100%). The emission spectral brightness of these entangled sources reaches 4.2*105 /(s.nm.mW). The quality of the photon pair generated in continuous and pulse pump regimes are compared. High qualities of these multiplexed entanglement sources make them very promising to be used in future minimized quantum communication and computation systems.

Gap plasmon-enhanced photoluminescence of monolayer MoS2 in hybrid nanostructure*

Monolayer transition-metal dichalcogenides (TMDs) have attracted a lot of attention for their applications in optics and optoelectronics. Molybdenum disulfide (MoS2), as one of those important materials, has been widely investigated due to its direct band gap and photoluminescence (PL) in visible range. Owing to the fact that the monolayer MoS2 suffers low light absorption and emission, surface plasmon polaritons (SPPs) are used to enhance both the excitation and emission efficiencies. Here, we demonstrate that the PL of MoS2 sandwiched between 200-nm-diameter gold nanoparticle (AuNP) and 150-nm-thick gold film is improved by more than 4 times compared with bare MoS2 sample. This study shows that gap plasmons can possess more optical and optoelectronic applications incorporating with many other emerging two-dimensional materials.