-Ping Li

A Power Plane With Wideband SSN Suppression Using a Multi-Via Electromagnetic Bandgap Structure

In this letter, a power plane with wideband simultaneous switching noise (SSN) suppression using a novel multi-via electromagnetic bandgap (EBG) structure is proposed. The -40dB stopband of the proposed EBG structure is about two to six times wider than the one-via structure, and the relative bandwidth is increased by about two times. It is implemented by only adding some vias between patches and the reference plane without changing any other geometrical parameters from one-via EBG structures. The excellent SSN suppression performance was verified by simulations and measurements

A Double-Surface Electromagnetic Bandgap Structure With One Surface Embedded in Power Plane for Ultra-Wideband SSN Suppression

In this letter, a double-surface electromagnetic bandgap (EBG) structure with one EBG surface embedded in power plane is proposed for ultra-wideband simultaneous switching noise (SSN) suppression in printed circuit boards. The SSN suppression bandwidth is broadened to wider than 30 GHz with a low start frequency by combining traditional EBG structure and the coplanar EBG structure which is embedded in the power plane. Because the coplanar EBG surface is embedded in the power plane, no additional metal layer is introduced by the double-surface EBG structure. Simulations and measurements are performed to verify the broadband SSN suppression, high performance is observed.

Simultaneous Switching Noise Suppression in Printed Circuit Boards Using a Compact 3-D Cascaded Electromagnetic-Bandgap Structure

In this paper, a deep bandgap behavior analysis of the vertical cascaded electromagnetic-bandgap (EBG) structure is made. It is shown that the vertical cascaded EBG structure can be decomposed into two EBG structures cascaded horizontally, one with the bigger patches and the other with the smaller patches. The design guidelines of the vertical cascaded EBG structure are drawn. Furthermore, the vertical cascade concept is extended to 3-D cascade for wideband simultaneous switching noise (SSN) suppression. The number of rows of patches for noise coupling reduction is investigated. Building SSN isolation walls along a printed circuit board for wideband electromagnetic-interference reduction and along sensitive devices for SSN isolation using a 3-D cascaded EBG structure is proposed. Simulations and measurements are performed to verify the SSN suppression. High performance is observed.

Signal Integrity Analysis of the Traces in Electromagnetic-Bandgap Structure in High-Speed Printed Circuit Boards and Packages

In this paper, signal integrity analysis of traces between two parallel planes with an electromagnetic-bandgap (EBG) structure is made. It is shown that, within the stopband, the signal transmission quality is excellent, traces in the EBG structure are free from cavity resonances, and behave as regular standard transmission lines. It is shown that the high-impedance surface behaves as a solid continuous reference plane within the stopband. The impedances of the traces between the high-impedance surface and the reference planes are extracted. It is found that the extracted impedances are exactly the same as striplines with the same parameters. It is shown that the traces between the high-impedance surface and the reference planes are regular standard striplines within the stopband. In addition, a novel four-via EBG structure is proposed to broaden the stopband for simultaneous switching noise suppression in high-speed digital printed circuit boards and packages. This four-via EBG structure has a higher relative bandwidth and lower center frequency. Compared with one-via EBG structure with the same parameters, the stopband is broadened three times and relative bandwidth is increased 1.3 times, while there is very little additional cost since there is no more change than number of vias. Two test boards with four-via EBG structure were fabricated to verify the signal integrity of the traces and the impedances extraction. Good agreements are observed between the simulations and measurements

An Efficient Power-Delivery Method for the Design of the Power Distribution Networks for High-Speed Digital Systems

In this paper, a new power distribution network (PDN) design method from a power delivery viewpoint is proposed. Two new parameters, the power delivery delay and the DeltaV time constant, are introduced to characterize the effects of the lead inductors and decoupling capacitors on the timely power delivery respectively for a high-speed PDN. The decoupling time of a PDN is accurately estimated from the power delivery delay introduced by the inductance of the discontinuities, the charge delivery speed, and the charge supply capacity of the decoupling capacitors are accurately characterized by the DeltaV time constant. Based on the two parameters, a complete and systematic power-delivery method for the design of a PDN is developed. The proposed design method is verified by SPICE, full-wave simulations, and measurements. For completion, some specific design considerations are also discussed in detail.

Analyze and Design High-Speed Power Delivery Networks Using New Multiinput Impedances in Printed Circuit Boards

In this paper, a new input impedance, the multiinput impedance, which includes all information of the full impedance matrix, is proposed to accurately analyze and design planar power delivery networks (PDNs) in high-speed printed circuit boards and packages. The multiinput impedance includes all of the potential impacts of the other operating active power ports in both low and high frequencies. A systematical power-delivery-network analysis and design method using the multiinput impedance is developed. The global and local characteristics of the decoupled PDN are well demonstrated by the multiinput impedance, which make the analysis and design of the modern decoupled PDNs more accurate and reliable. Numerical and measured results show that the proposed multiinput impedance can characterize both the global and local characteristics of the planar PDNs with high accuracy.

Modeling and Analyzing High-Speed and High-Density Connectors by Using Multisegment Multiple Transmission Lines Model

In this paper, a new multisegment multiple transmission lines (MMTLs) SPICE model is developed to model and analyze high-speed and high-density connectors based on time domain reflectometry (TDR) measurements. It has advantages over the distributed inductance-capacitance (LC) model in aspects of stability and efficiency. The model is easy to understand and optimize. Its accuracy is easy to control. The precision function of the MMTL is extracted through simulations and measurements on which the modeling automation is based. Feedback theory is adopted to realize the automation process. Pro rata sampling method is introduced to reduce the variable space of the segments. Partial binary search method is applied to accelerate the search speed. With the novel modeling technique, a high accuracy model could be generated in a few minutes. The experimental results show that the proposed modeling method is of high accuracy and efficiency.

Super-Wideband SSN Suppression in High-Speed Digital Communication Systems by Using Multi-Via Electromagnetic Bandgap Structures

With the advance of semiconductor manufacturing, EDA, and VLSI design technologies, circuits with even higher speed are integrated at an even higher density. Simultaneous switching noise (SSN) severely affects the performance of ICs and communication systems. In this paper, a novel multi-via electromagnetic bandgap (MV-EBG) structure is proposed with super-wideband SSN suppression. The stopband of the proposed MV-EBG structure is much wider than the traditional one, about 2 to 6 times. Little extra cost is added since there is no more change than the numbers of the vias. Further, a novel MV-EBG structure that formed by merging one-via EBG structures into different shape is proposed. Like the MV-EBG structures, Merged EBG structures also exhibit a wideband characteristic. The excellent SSN suppression of the MV-EBG and merged EBG structures are verified by simulations and measurements. Good performances are observed.