Lin Xiaoling

The reliability evaluation of Cu wire Bonding by using focus ion beam system

The cross sections of bonding have been made by using focus ion beam(FIB) system on the advanced chips packaged with BGA. Through the measurement of aluminum layer thickness under different bond force, the bonding reliability has been evaluated. The comparison has also been made on the interface of Au wire Bonding and Cu wire Bonding. Since the Cu wire Bonding process is more difficult, When it is used in the advanced chips, the bonding reliability should be evaluated.

Effect of dummy via on the SIV performance of narrow-wide copper interconnection

Based on the stress induced void theory, three kinds of narrow-wide two-layer copper interconnection structure with dummy via in M1 were designed and put under different high temperature conditions for test. Under the action of high temperature, influence of dummy vias in lower layer metal (M1) on the failure phenomenon of the interconnect structure was analyzed. The result shows, adding dummy via in M1 can effectively improve the SIV performance of copper interconnection. Based on this, a more accurate equation was put forward to describe the behavior of the vacancy in the structure with dummy via spreading from the diffusion source to the accumulation.

FIB fast positioning technology and its application

Three kinds of FIB fast positioning technology were studied, including positioning according to the coordinate position, positioning with the help of navigation software, positioning according to optical image. They can be used for different use of purpose. Among them, positioning with the help of navigation software is suitable for invisible metal layer editing with minimum damage on die. At the same time, several cases are given to show how FIB fast positioning technology works.

Development and application of prognostics and health management technology

Prognostics and health management (PHM) refers to functions that equipment in use can automatically complete the fault detection, prediction, isolation and monitoring, and timely fault impact assessment, fault report and condition monitoring management. This paper analyzes the requirement of engineering application and development of PHM technology. It focuses on three aspects technical problems of the application of PHM technology, including fault diagnosis and prediction model based on physics-of-failure (PoF), data mining technology and special sensors for critical failure mechanism of MOS devices. Correspondingly, present research work on these three aspects is introduced.

Influence of package failure on IC's reliability

Different packaging materials and packaging forms have different influence on the reliability of devices. For the semiconductor device, failure mode caused by wire bond is up to nearly 49%. Therefore, understanding of the structure characteristics of various packaging and their main failure modes and mechanism has important meaning to improve the reliability of devices being used. In this paper, three kinds of common failure modes and failure mechanism of packaged devices are analyzed. Also, some precautions for reducing such failures are presented.