M. J. Ludowise

High-power AlGaInN flip-chip light-emitting diodes

Data are presented on high-power AlGaInN flip-chip light-emitting diodes (FCLEDs). The FCLED is “flipped-over” or inverted compared to conventional AlGaInN light-emitting diodes (LEDs), and light is extracted through the transparent sapphire substrate. This avoids light absorption from the semitransparent metal contact in conventional epitaxial-up designs. The power FCLED has a large emitting area (∼0.70 mm2) and an optimized contacting scheme allowing high current (200–1000 mA, J∼30–143 A/cm2) operation with low forward voltages (∼2.8 V at 200 mA), and therefore higher power conversion (“wall-plug”) efficiencies. The improved extraction efficiency of the FCLED provides 1.6 times more light compared to top-emitting power LEDs and ten times more light than conventional small-area (∼0.07 mm2) LEDs. FCLEDs in the blue wavelength regime (∼435 nm peak) exhibit ∼21% external quantum efficiency and ∼20% wall-plug efficiency at 200 mA and with record light output powers of 400 mW at 1.0 A.

Correlation of cathodoluminescence inhomogeneity with microstructural defects in epitaxial GaN grown by metalorganic chemical-vapor deposition

We discuss the relationship between microstructure and luminescence efficiency for heteroepitaxial films of GaN grown on c-axis sapphire substrates by metalorganic chemical-vapor deposition. We directly characterize the correlation between threading dislocations as observed by transmission electron microscopy, surface morphology as observed by atomic force microscopy, and wavelength-resolved cathodoluminescence imaging. We show that the inhomogeneity in the luminescence intensity of these films near band edge can be accounted for by a simple model where nonradiative recombination at threading dislocations causes a deficiency of minority carriers and results in dark regions of the epilayer. An upper bound for average diffusion length is estimated to be 250 nm.

High Power LEDs – Technology Status and Market Applications

High power light emitting diodes (LEDs) continue to increase in output flux with the best III-nitride based devices today emitting over 150 lm of white, cyan, or green light. The key design features of such products will be covered with special emphasis on power packaging, flip-chip device design, and phosphor coating technology. The high-flux performance of these devices is enabling many new applications for LEDs. Two of the most interesting of these applications are LCD display backlighting and vehicle forward lighting. The advantages of LEDs over competing lighting technologies will be covered in detail.

Optical cavity effects in InGaN/GaN quantum-well-heterostructure flip-chip light-emitting diodes

Optical cavity effects have a significant influence on the extraction efficiency of InGaN/GaN quantum-well-heterostructure flip-chip light-emitting diodes (FCLEDs). Light emitted from the quantum well (QW) self-interferes due to reflection from a closely placed reflective metallic mirror. The interference patterns couple into the escape cone for light extraction from the FCLED. This effect causes significant changes in the extraction efficiency as the distance between the QW and the metallic mirror varies. In addition, the radiative lifetime of the QW also changes as a function of the distance between the QW and the mirror surface. Experimental results from packaged FCLEDs, supported by optical modeling, show that a QW placed at an optimum distance from the mirror provides a ∼2.3× increase in total light output as compared to a QW placed at a neighboring position corresponding to a minimum in overall light extraction.

A study of parasitic reactions between NH 3 and TMGa or TMAl

The growth of AlGaN using organometallic vapor phase epitaxy has been studied as a function of reactor pressure in a horizontal reactor. At atmospheric pressure, GaN with growth efficiency comparable to that of GaAs in the same reactor is obtained. In addition, the GaN growth efficiency changes little at different reactor pressures. These results indicate that the parasitic reaction between TMGa and NH3 is not substantial in the reactor used in this study. On the other hand, A1N growth at atmospheric pressure has not been possible. By lowering the reactor pressure below 250 Torr, A1N deposition is achieved. However, the growth efficiency decreases at higher reactor pressures and higher growth temperatures, indicating that a strong parasitic reaction occurs between TMAI and NH3. For the ternary AlGaN, lower pressure also leads to more Al incorporation. The results indicate that parasitic reactions are much more severe for TMAI+NH3 than for TMGa+NH3.

Low‐resistance Ohmic conduction across compound semiconductor wafer‐bonded interfaces

Data are presented demonstrating low‐resistance Ohmic conduction across interfaces formed by high‐temperature (750–1000 °C) compound semiconductor wafer bonding. Unipolar junctions formed by wafer bonding surfaces consisting of In0.5Ga0.5P/In0.5Ga0.5P, GaP/GaP, GaP/In0.5Ga0.5P, and In0.5Ga0.5P/GaAs are shown to exhibit low‐resistance Ohmic conduction for both p‐ and n‐isotype junctions. The achievement of these properties is demonstrated to be critically dependent upon the crystallographic alignment of the bonded wafer surfaces, irrespective of the lattice mismatch between the surfaces. Specifically, we show that the surface orientation of the bonded surfaces must be nominally matched while simultaneously maintaining rotational alignment of the wafers.

High‐Power III‐Nitride Emitters for Solid‐State Lighting

High-power, large-area InGaN/GaN quantum-well heterostructure light-emitting diodes based on an inverted, or flip-chip, configuration are described. These devices are mounted in specially designed high-power (1-5 W) packages and exhibit high extraction efficiency and low operating voltage. In the blue wavelength regime, output powers greater than 250 mW (1 x 1 mm 2 device) and 1 W (2 x 2 mm 2 device) are delivered at standard operating current densities (50 A/cm 2 ), corresponding to wall-plug efficiencies of 22%-23%. Employing phosphors for the generation of white light, these same devices achieve luminous efficiencies greater than 30 lm/W.

Hydrogen-decorated lattice defects in proton implanted GaN

Several vibrational bands were observed near 3100 cm−1 in GaN that had been implanted with hydrogen at room temperature and subsequently annealed. Our results indicate that these bands are due to nitrogen-dangling-bond defects created by the implantation that are decorated by hydrogen. The frequencies are close to those predicted recently for VGa–Hn complexes, leading us to tentatively assign the new lines to VGa defects decorated with different numbers of H atoms.

Long wavelength (λ∼1.5 μm) native‐oxide‐defined InAlAs‐InP‐InGaAsP quantum well heterostructure laser diodes

Native oxidation (‘‘wet’’ oxidation via H2O vapor+N2) of InAlAs is employed to fabricate long wavelength (λ∼1.5 μm) InAlAs‐InP‐InGaAsP quantum well heterostructure laser diodes. Data are presented on gain‐guided native‐oxide‐defined stripe‐geometry lasers (40 μm×500 μm) with threshold currents of 200 mA (1 kA/cm2) emitting with multiple longitudinal modes centered at λ∼1.5 μm. The threshold currents, approximated as Ith=I0 exp(T/T0), exhibit a characteristic temperature of T0∼49 K and an operating temperature as high as T=70 °C. Maximum continuous output powers of 140 mW/facet (uncoated facets) and a differential quantum efficiency of 38% are achieved.

Analysis of wafer fusing for 1.3 μm vertical cavity surface emitting lasers

We report low densities of electrically active defects and low optical losses at the wafer fused interface between InP and GaAs. Electron beam induced current analysis shows electrically active defects with an average spacing of 4.5 μm at the interface and significantly lower densities 0.4 μm from the fused interface. Optical measurements of a Fabry–Perot resonator made by fusing an InP epilayer to a GaAs/AlAs mirror demonstrate a 3% increase in mirror transmission after fusing and negligible absorption at the fused interface. Based on these results, we present design considerations for fused surface emitting lasers.