Makoto Akita | Researchain

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Featured researches published by Makoto Akita.

Archive | 2002

Apparatus and method for mounting electronic components

Shunji Onobori; Shuichi Hirata; Masakazu Yamano; Kazuya Yamamoto; Satoshi Shida; Takaharu Mae; Makoto Akita; Shozo Minamitani

Archive | 1999

Bump joining judging device and method, and semiconductor component production device and method

Shozo Minamitani; Kazushi Higashi; Kenji Takahashi; Shinji Kanayama; Hiroshi Wada; Takafumi Tsujisawa; Makoto Akita; Kenji Okamoto; Shinzo Eguchi; Yasuhiro Kametani

Archive | 2003

Electronic component mounting method and apparatus and ultrasondic bonding head

Shozo Minamitani; Takaharu Mae; Yasuharu Ueno; Akira Yamada; Shinji Kanayama; Makoto Akita; Nobuhisa Watanabe; Akira Mori; Hiroyuki Naito; Shinya Marumo; Makoto Morikawa

Archive | 2007

Component mounting method, component mounting apparatus, and ultrasonic bonding head

Shozo Minamitani; Takaharu Mae; Yasuharu Ueno; Akira Yamada; Shinji Kanayama; Makoto Akita; Nobuhisa Watanabe; Akira Mori; Hiroyuki Naito; Shinya Marumo; Makoto Morikawa

Archive | 2000

Apparatus and method for carrying tape-like circuit board

Makoto Akita; Shinji Kanayama; Shunji Onobori; Satoshi Shida; Takafumi Tsujisawa; 智仕田; 俊司尾登; 誠秋田; 孝文辻澤; 真司金山

Archive | 2003

Komponentenanbringverfahren, komponentenanbringvorrichtung und ultraschallbondierungskopf Komponentenanbringverfahren, komponentenanbringvorrichtung and ultraschallbondierungskopf

Makoto Akita; Shinji Kanayama; Takaharu Mae; Shinya Marumo; Shozo Minamitani; Akira Mori; Makoto Ikoma-shi Morikawa; Hiroyuki Naito; Yasuharu Ueno; Nobuhisa Watanabe; Akira Yamada

Archive | 2003

Komponentenanbringverfahren, komponentenanbringvorrichtung und ultraschall-bondierungskopf Komponentenanbringverfahren, komponentenanbringvorrichtung and ultrasonic bonding head

Shozo Minamitani; Takaharu Mae; Yasuharu Ueno; Akira Yamada; Shinji Kanayama; Makoto Akita; Nobuhisa Watanabe; Akira Mori; Hiroyuki Naito; Shinya Marumo; Makoto Morikawa

Archive | 1999

Device and method for evaluation of a lothöckerzusammenmbaus, and related semiconductor manufacturing apparatus and method

Makoto Akita; Shinzo Eguchi; Kazushi Neyagawa-shi Higashi; Yasuhiro Kametani; Shinji Kanayama; Shozo Minamitani; Kenji Hirakata-shi Okamoto; Kenji Takahashi; Takafumi Toyonaka-shi Tsujisawa; Hiroshi Wada

Archive | 1999

Gerät und Verfahren zur Auswertung eines Lothöckerzusammenbaus

Shozo Minamitani; Kazushi Higashi; Kenji Takahashi; Shinji Kanayama; Hiroshi Wada; Takafumi Tsujisawa; Makoto Akita; Kenji Okamoto; Shinzo Eguchi; Yasuhiro Kametani

Archive | 1999

Dispositif pour evaluer un assemblage par bosses et procede y relatif, et dispositif de production d'un composant a semiconducteur et procede y relatif

Makoto Akita; Shinzo Eguchi; Kazushi Higashi; Yasuhiro Kametani; Shinji Kanayama; Shozo Minamitani; Kenji Okamoto; Kenji Takahashi; Takafumi Tsujisawa; Hiroshi Wada

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