Takafumi Tsujisawa | Researchain

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Featured researches published by Takafumi Tsujisawa.

Archive | 1999

Bump joining judging device and method, and semiconductor component production device and method

Shozo Minamitani; Kazushi Higashi; Kenji Takahashi; Shinji Kanayama; Hiroshi Wada; Takafumi Tsujisawa; Makoto Akita; Kenji Okamoto; Shinzo Eguchi; Yasuhiro Kametani

Archive | 2001

Bump joining method

Shozo Minamitani; Kazushi Higashi; Kenji Takahashi; Shinji Kanayama; Hiroshi Wada; Takafumi Tsujisawa

Archive | 2005

APPARATUS AND METHOD OF MOUNTING COMPONENT

Takafumi Tsujisawa; 孝文辻澤

Archive | 2005

Wafer expanding apparatus, component supplying apparatus and wafer sheet expanding method

Shoriki Narita; Shuichi Hirata; Takafumi Tsujisawa; Hirokuni Miyazaki; Satoshi Shida

Archive | 2005

Wafer Expanding Device, Component Feeder, and Expanding Method for Wafer Sheet

Shoriki Narita; Shuichi Hirata; Takafumi Tsujisawa; Hirokuni Miyazaki; Satoshi Shida

Archive | 2000

Apparatus and method for carrying tape-like circuit board

Makoto Akita; Shinji Kanayama; Shunji Onobori; Satoshi Shida; Takafumi Tsujisawa; 智仕田; 俊司尾登; 誠秋田; 孝文辻澤; 真司金山

Archive | 2006

BUMP JOINING DEVICE AND METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING DEVICE

Kazuji Azuma; Shinji Kanayama; Shozo Minamitani; Kenji Takahashi; Takafumi Tsujisawa; Hiroshi Wada; 昌三南谷; 浩和田; 和司東; 孝文辻澤; 真司金山; 健治高橋

Archive | 2005

Appareil de montage de composant et procede de montage de composant

Shuichi Hirata; Makoto Morikawa; Shinya Marumo; Yasuharu Ueno; Takafumi Tsujisawa

Archive | 2005

ウェハエキスパンド装置、部品供給装置、及びウェハシートのエキスパンド方法

Shoriki Narita; Shuichi Hirata; Takafumi Tsujisawa; Hirokuni Miyazaki; Satoshi Shida

Archive | 1999

Gerät und Verfahren zur Auswertung eines Lothöckerzusammenbaus

Shozo Minamitani; Kazushi Higashi; Kenji Takahashi; Shinji Kanayama; Hiroshi Wada; Takafumi Tsujisawa; Makoto Akita; Kenji Okamoto; Shinzo Eguchi; Yasuhiro Kametani

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