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Dive into the research topics where Makoto Imanishi is active.

Publication


Featured researches published by Makoto Imanishi.


Archive | 1998

Bump bonding method and bump bonding apparatus

Takahiro Yonezawa; Osamu Nakao; Shinji Kanayama; Akihiro Yamamoto; Makoto Imanishi; Koichi Yoshida


Archive | 2001

Bump bonding apparatus and method

Shoriki Narita; Makoto Imanishi; Takaharu Mae; Shinji Kanayama; Nobuhisa Watanabe


Archive | 2001

Device and method for forming bump

Shoriki Narita; Kouichi Yoshida; Masahiko Ikeya; Takaharu Mae; Shinji Kanayama; Makoto Imanishi; Kazushi Higashi; Kenji Fukumoto; Hiroshi Wada


Archive | 1996

Linear actuating apparatus

Satoshi Shida; Akira Kabeshita; Shinji Kanayama; Kenji Takahashi; Makoto Imanishi; Osamu Nakao


Archive | 1997

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

Makoto Imanishi; Yoshifumi Kitayama; Koichi Kumagai; Shinji Kanayama; Yoshinori Wada; Takahiro Yonezawa; Kazushi Higashi


Archive | 1995

Ultrasonic wire bonding apparatus and method

Makoto Morita; Masaru Nagaike; Richard Gueler; Makoto Imanishi; Takahiro Yonezawa


Archive | 1995

SEMICONDUCTOR MOUNTING EQUIPMENT

Makoto Imanishi; Akira Kabeshita; Shinji Kanayama; Satoshi Shida; Kenji Takahashi; 誠 今西; 智 仕田; 朗 壁下; 真司 金山; 健治 高橋


Archive | 2001

Heating apparatus for bump bonding, bump bonding method and bump forming apparatus, and semiconductor wafer

Shoriki Narita; Makoto Imanishi; Takaharu Mae; Nobuhisa Watanabe; Shinji Kanayama


Archive | 1996

Apparatus for mounting an electronic component

Makoto Imanishi; Akira Kabeshita; Kohei Enchi; Satoshi Shida


Archive | 2009

ELECTRONIC COMPONENT AND RESIN PACKAGING METHOD FOR ELECTRONIC COMPONENT

Makoto Imanishi; Yoshihiro Tomura; Kentaro Kumazawa

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