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Dive into the research topics where Takahiro Yonezawa is active.

Publication


Featured researches published by Takahiro Yonezawa.


Archive | 1998

Bump bonding method and bump bonding apparatus

Takahiro Yonezawa; Osamu Nakao; Shinji Kanayama; Akihiro Yamamoto; Makoto Imanishi; Koichi Yoshida


Archive | 1997

Method of forming a ball bond using a bonding capillary

Kazushi Higashi; Norihito Tsukahara; Takahiro Yonezawa; Yoshihiko Yagi; Yoshifumi Kitayama; Hiroyuki Otani


Archive | 1993

Mounting apparatus of electronic component

Takahiro Yonezawa; Wataru Hirai; Muneyoshi Fujiwara; Kunio Sakurai; Naohiko Chimura; Hiroshi Ohta


Archive | 1997

Method and apparatus for packaging IC chip, and tape-shaped carrier to be used therefor

Makoto Imanishi; Yoshifumi Kitayama; Koichi Kumagai; Shinji Kanayama; Yoshinori Wada; Takahiro Yonezawa; Kazushi Higashi


Archive | 1992

Apparatus for mounting electronic component on substrate

Muneyoshi Fujiwara; Wataru Hirai; Takahiro Yonezawa; Kunio Sakurai


Archive | 1995

Ultrasonic wire bonding apparatus and method

Makoto Morita; Masaru Nagaike; Richard Gueler; Makoto Imanishi; Takahiro Yonezawa


Archive | 2002

Bump bonding method and apparatue

Satoshi Horie; Takahiro Yonezawa; Hiroyuki Kiyomura; Tetsuya Tokunaga; Tatsuo Sasaoka


Archive | 1997

Semiconductor element having a bump electrode

Kazushi Higashi; Yoshifumi Kitayama; Hiroyuki Otani; Norihito Tsukahara; Yoshihiko Yagi; Takahiro Yonezawa


Archive | 2005

Semiconductor element having protruded bump electrodes

Kazushi Higashi; Norihito Tsukahara; Takahiro Yonezawa; Yoshihiko Yagi; Yoshifumi Kitayama; Hiroyuki Otani


Archive | 2002

Bump bonding method apparatus

Satoshi Horie; Takahiro Yonezawa; Hiroyuki Kiyomura; Tetsuya Tokunaga; Tatsuo Sasaoka

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