Maksym Myronov

Band engineering and growth of tensile strained Ge/(Si)GeSn heterostructures for tunnel field effect transistors

In this letter, we propose a heterostructure design for tunnel field effect transistors with two low direct bandgap group IV compounds, GeSn and highly tensely strained Ge in combination with ternary SiGeSn alloy. Electronic band calculations show that strained Ge, used as channel, grown on Ge 1−xSnx (x > 9%) buffer, as source, becomes a direct bandgap which significantly increases the tunneling probability. The SiGeSn ternaries are well suitable as drain since they offer a large indirect bandgap. The growth of such heterostructures with the desired band alignment is presented. The crystalline quality of the (Si)Ge(Sn) layers is similar to state-of-the-art SiGe layers.

Extremely high room-temperature two-dimensional hole gas mobility in Ge/Si0.33Ge0.67/Si(001) p-type modulation-doped heterostructures

To extract the room-temperature drift mobility and sheet carrier density of two-dimensional hole gas (2DHG) that form in Ge strained channels of various thicknesses in Ge/Si0.33Ge0.67/Si(001) p-type modulation-doped heterostructures, the magnetic field dependences of the magnetoresistance and Hall resistance at temperature of 295 K were measured and the technique of maximum entropy mobility spectrum analysis was applied. This technique allows a unique determination of mobility and sheet carrier density of each group of carriers present in parallel conducting multilayers semiconductor heterostructures. Extremely high room-temperature drift mobility (at sheet carrier density) of 2DHG 2940 cm2 V–1 s–1 (5.11×1011 cm–2) was obtained in a sample with a 20 nm thick Ge strained channel.

Reverse graded relaxed buffers for high Ge content SiGe virtual substrates

An innovative approach is proposed for epitaxial growth of high Ge content, relaxed Si1−xGex buffer layers on a Si(001) substrate. The advantages of the technique are demonstrated by growing such structures via chemical vapor deposition and their characterization. Relaxed Ge is first grown on the substrate followed by the reverse grading approach to reach a final buffer composition of 0.78. The optimized buffer structure is only 2.8μm thick and demonstrates a low surface threading dislocation density of 4×106cm−2, with a surface roughness of 2.6nm. The buffers demonstrate a relaxation of up to 107%.

Reverse graded SiGe/Ge/Si buffers for high-composition virtual substrates

The effect of compositional grading rate on reverse linear graded silicon germanium virtual substrates, grown by reduced pressure chemical vapor deposition, is investigated. For a Si(001)/Ge/RLG/Si0.22Ge0.78 buffer of 2.4 μm total thickness the threading dislocation density (TDD) within the top, fully relaxed, Si0.22Ge0.78 layer is 4×106 cm−2, with a surface roughness of 3 nm. For a thicker buffer, where the grading rate is reduced, a lower TDD of 3×106 cm−2 and a surface roughness of 2 nm can be achieved. The characteristics of reverse graded Si0.22Ge0.78 virtual substrates are shown to be comparable to, or exceed, conventional buffer techniques, leading to thinner high-quality high Ge composition SiGe virtual substrates.

Observation of two-dimensional hole gas with mobility and carrier density exceeding those of two-dimensional electron gas at room temperature in the SiGe heterostructures

Very high two-dimensional hole gas (2DHG) drift mobility of 3100cm2∕Vs is obtained at extremely high density of 41×1011cm−2 in the modulation doped, 20nm thick, strained Ge quantum well (QW) of SiGe heterostructure at room temperature. Very high 2DHG density is achieved by increasing the boron modulation doping, reducing the spacer layer thickness located between it and Ge QW, and increasing the valence-band offset of Ge QW, which also results in the enhancement of mobility. The obtained 2DHG mobility and carrier density exceed those reported for two-dimensional electron gas in the strained Si QW of SiGe heterostructures.

Ohmic contacts to n-type germanium with low specific contact resistivity

A low temperature nickel process has been developed that produces Ohmic contacts to n-type germanium with specific contact resistivities down to (2.3 ± 1.8) × 10−7 Ω-cm2 for anneal temperatures of 340 °C. The low contact resistivity is attributed to the low resistivity NiGe phase which was identified using electron diffraction in a transmission electron microscope. Electrical results indicate that the linear Ohmic behaviour of the contact is attributed to quantum mechanical tunnelling through the Schottky barrier formed between the NiGe alloy and the heavily doped n-Ge.

Hole density dependence of effective mass, mobility and transport time in strained Ge channel modulation-doped heterostructures

We performed systematic low-temperature (T = 350 mK–15 K) magnetotransport measurements on the two-dimensional hole gas with various sheet carrier densities Ps = (0.57–2.1)×1012 cm–2 formed in the strained Ge channel modulation-doped (MOD) SiGe heterostructures grown on Si substrates. It was found that the effective hole mass deduced by temperature dependent Shubnikov–de Hass oscillations increased monotonically from (0.087±0.05)m0 to (0.19±0.01)m0 with the increase of Ps, showing large band nonparabolicity in strained Ge. In contrast to this result, the increase of the mobility with increasing Ps (up to 29 000 cm2/V s) was observed, suggesting that Coulomb scattering played a dominant role in the transport of the Ge channel at low temperatures. In addition, the Dingle ratio of the transport time to the quantum lifetime was found to increase with increasing Ps, which was attributed to the increase of remote impurity scattering with the increase of the doping concentration in MOD SiGe layers.

Modulation of the absorption coefficient at 1.3 μm in Ge/SiGe multiple quantum well heterostructures on silicon

We report modulation of the absorption coefficient at 1.3 μm in Ge/SiGe multiple quantum well heterostructures on silicon via the quantum-confined Stark effect. Strain engineering was exploited to increase the direct optical bandgap in the Ge quantum wells. We grew 9 nm-thick Ge quantum wells on a relaxed Si0.22Ge0.78 buffer and a contrast in the absorption coefficient of a factor of greater than 3.2 was achieved in the spectral range 1290-1315 nm.

Modelling the inhomogeneous SiC Schottky interface

For the first time, the I-V-T dataset of a Schottky diode has been accurately modelled, parameterised, and fully fit, incorporating the effects of interface inhomogeneity, patch pinch-off and resistance, and ideality factors that are both heavily temperature and voltage dependent. A Ni/SiC Schottky diode is characterised at 2 K intervals from 20 to 320 K, which, at room temperature, displays low ideality factors (n   8), voltage dependent ideality factors and evidence of the so-called “thermionic field emission effect” within a T0-plot, suggest significant inhomogeneity. Two models are used, each derived from Tungs original interactive parallel conduction treatment of barrier height inhomogeneity that can reproduce these commonly seen effects in single temperature I-V traces. The first model incorporates patch pinch-off effects and produces accurate and reliable fits above around 150 K, and at current densities lower than 10−5 A cm−2. Outside this region, we show that resistive effects within a given patch are responsible for the excessive ideality factors, and a second simplified model incorporating these resistive effects as well as pinch-off accurately reproduces the entire temperature range. Analysis of these fitting parameters reduces confidence in those fits above 230 K, and questions are raised about the physical interpretation of the fitting parameters. Despite this, both methods used are shown to be useful tools for accurately reproducing I-V-T data over a large temperature range.

Ultra-high hole mobility exceeding one million in a strained germanium quantum well

In this paper, we report a Hall mobility of one million in a germanium two-dimensional hole gas. The extremely high hole mobility of 1.1 × 106 cm2 V−1 s−1 at a carrier sheet density of 3 × 1011 cm−2 was observed at 12 K. This mobility is nearly an order of magnitude higher than any previously reported. From the structural analysis of the material and mobility modeling based on the relaxation time approximation, we attribute this result to the combination of a high purity Ge channel and a very low background impurity level that is achieved from the reduced-pressure chemical vapor deposition growth method.