Marc Andre De Samber

Integrated LED modules

An experimental and modeling study was done on the system architecture of integrated LED modules. Goal was to realize minimal footprint modules with optimized LED-to-package ratio and integrated driver aiming at maximal étendue and maximal lumens/area light output. This while staying within the boundary conditions of thermal load on the LEDs, driver ASIC and package and assembly materials. A number of multi-LED multi-color intelligent modules were designed, modeled, realized and evaluated. Lateral and vertical configurations of LEDs and ASIC in a leadless package were realized based on industrially known assembly technologies and using available LEDs and a dedicated ASIC chip. Concurrent design of module and receiving printed board was used to obtain the best thermal solution.

Exploring the ulthimo platform

A substrate level (matrix) single die packaging technology is used as the basis for an electronic packaging platform. This Ulthimo (ultra thin multi die outline) or nowadays called UTLP (ultra thin leadless package) technology was originally developed for high frequency transistor packaging. Onto its core process flow dedicated process modules are added to enable its use for packaging of more complex functionalities. The added process modules are chosen such that they fit on the base process flow without jeopardizing these base process steps. The platform based applications are multi-die packaging including vertical dies, 3-dimensional sensor packaging and biofluidic packaging