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Dive into the research topics where Eric Cornelis Egbertus Van Grunsven is active.

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Featured researches published by Eric Cornelis Egbertus Van Grunsven.


electronics system integration technology conference | 2010

Integrated LED modules

Marc Andre De Samber; Eric Cornelis Egbertus Van Grunsven; Erik Eggink; Wil Peels

An experimental and modeling study was done on the system architecture of integrated LED modules. Goal was to realize minimal footprint modules with optimized LED-to-package ratio and integrated driver aiming at maximal étendue and maximal lumens/area light output. This while staying within the boundary conditions of thermal load on the LEDs, driver ASIC and package and assembly materials. A number of multi-LED multi-color intelligent modules were designed, modeled, realized and evaluated. Lateral and vertical configurations of LEDs and ASIC in a leadless package were realized based on industrially known assembly technologies and using available LEDs and a dedicated ASIC chip. Concurrent design of module and receiving printed board was used to obtain the best thermal solution.


Archive | 2005

Method of Manufacturing an Image Sensor and Image Sensor

Joris Pieter Valentijn Maas; Leendert De Bruin; Daniel Wilhelmus Elisabeth Verbugt; Nicolaas Johannes Anthonius Van Veen; Eric Cornelis Egbertus Van Grunsven; Gerardus L. J. Reuvers; Erik Harold Groot


Archive | 2006

Producing a covered through substrate via using a temporary cap layer

Johan Hendrik Klootwijk; Antonius L. A. M. Kemmeren; Ronald Dekker; Eric Cornelis Egbertus Van Grunsven; F. Roozeboom


Archive | 2009

Through-substrate via and redistribution layer with metal paste

F. Roozeboom; Eric Cornelis Egbertus Van Grunsven; Franciscus Hubertus Marie Sanders; Maria Mathea Antonetta Burghoorn


Archive | 2013

Fan-out chip scale package

Jan Gulpen; Tonny Kamphuis; Pieter Hochstenbach; Leo Van Gemert; Eric Cornelis Egbertus Van Grunsven; Marc Andre De Samber


Handbook of 3D Integration: Technology and Applications of 3D Integrated Circuits | 2008

Deep Reactive Ion Etching of Through Silicon Vias

F. Roozeboom; M. A. Blauw; Yann Pierre Roger Lamy; Eric Cornelis Egbertus Van Grunsven; Wouter Dekkers; Jan F. Verhoeven; Eric van den Heuvel; Emile van der Drift; Erwin Kessels; Richard van de Sanden


Archive | 2006

Light Emitting Module and Manufacturing Method

Johannes Wilhelmus Weekamp; Willem Hoving; Eric Cornelis Egbertus Van Grunsven; Piet C. J. Rens; Gerard Maria Janssen


Archive | 2006

Micro Electromechanical Device For Tilting A Body In Two Degrees Of Freedom

Mark Theo Meuwese; Diederik Van Lierop; Ronald J. Asjes; Gerardus Lucien Mathildus Jansen; Eric Cornelis Egbertus Van Grunsven; Dannis Michel Brouwer


Archive | 2015

Liquid immersion transfer of electronics

Esther Anna Wilhelmina Gerarda Janssen; Marc Andre De Samber; Eric Cornelis Egbertus Van Grunsven; Egbertus Reinier Jacobs


Archive | 2012

LOW WARPAGE WAFER BONDING THROUGH USE OF SLOTTED SUBSTRATES

Marc Andre De Samber; Eric Cornelis Egbertus Van Grunsven; R.A.B. Engelen

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