Marcel Neitz

Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer

The goal of our research is the development of a single-mode electro-optical circuit board, the single-mode board-to-board pluggable connector and the single-mode chip-to-board coupling interface to silicon photonic devices. In this paper, the single-mode glass waveguide process is presented based on thermal silver ion-exchange for fabrication of low loss glass waveguide panels that will be developed for embedding as core layer of such printed circuit board. The single-mode glass waveguides (SM-WGs) were fabricated on 150 mm wafer size for characterization of different embedding scenarios. In the best case the measured propagation loss before and after lamination is below 0.1 dB/cm (λ=1550 nm). A suitable glass waveguide layer and embedding process was developed that can be applied for single-mode electro-optical circuit board fabrication.

Flexible long-range surface plasmon polariton single-mode waveguide for optical interconnects

We present the design, fabrication and characterization of long-range surface plasmon polariton waveguide arrays with materials, mainly silicones, carefully selected with the aim to be used as mechanically flexible single-mode optical interconnections, the so-called “plasmonic arc” working at 1.55µm. The fabricated plasmonic arcs show a TM/TE polarization ratio of ~25 dB. By using the cut-back method, the straight propagation loss at 1.55µm is estimated to 0.5-1 dB/mm and coupling loss to ~1-2 dB/facet after dicing. In the free-standing S-curved configuration, the bending loss of single cladding plasmonic arc is 2.2-2.8 dB/90° at bending radius 2.5 mm. For double cladding plasmonic arcs, it is decreased to 0.7-1.7 dB/90° for the same radius. The coupling loss with single-mode glass PCB waveguides is estimated to be 1.7 dB/interface in the best condition.

CO 2 -laser drilling of TGVs for glass interposer applications

Glass as a substrate material for interposer application has many benefits compared to conventional packaging materials like silicon, ceramic or polymer based laminates because of its excellent dielectric and transparent properties. Furthermore, the integration potential of glass is superior because of the dimensional stability under thermal load and the coefficient of thermal expansion (CTE) matching to that of silicon ICs. A small pitch size of conductor traces, small scale through-vias and high alignment accuracy are the key requirements that will be achieved from glass based packaging. Also the transparency of glass has benefits for photonic packaging. Glass substrates are available in wafer and large scale panel formats. Very fast CO2-laser drilling of holes and thermal post-treatments for reducing mechanical stress are very promising for fast processing and high reliability. Holes with a diameter smaller 100 μm in different glasses with thicknesses between 145 and 500 μm have been achieved by CO2-laser drilling. The holes have been metallized by sputtering a seed layer and galvanic copper platting. The CO2-laser drilling in combination with copper metallization has high potential for through glass via forming in glass substrates for interposer applications.

Single-mode glass waveguide technology for optical interchip communication on board level

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a hybrid packaging process and design issues are discussed.

Electro-optical circuit board with single-mode glass waveguide optical interconnects

A glass optical waveguide process has been developed for fabrication of electro-optical circuit boards (EOCB). Very thin glass panels with planar integrated single-mode waveguides can be embedded as a core layer in printed circuit boards for high-speed board-level chip-to-chip and board-to-board optical interconnects over an optical backplane. Such singlemode EOCBs will be needed in upcoming high performance computers and data storage network environments in case single-mode operating silicon photonic ICs generate high-bandwidth signals [1]. The paper will describe some project results of the ongoing PhoxTroT project, in which a development of glass based single-mode on-board and board-to-board interconnection platform is successfully in progress. The optical design comprises a 500 μm thin glass panel (Schott D263Teco) with purely optical layers for single-mode glass waveguides. The board size is accommodated to the mask size limitations of the fabrication (200 mm wafer level process, being later transferred also to larger panel size). Our concept consists of directly assembling of silicon photonic ICs on cut-out areas in glass-based optical waveguide panels. A part of the electrical wiring is patterned by thin film technology directly on the glass wafer surface. A coupling element will be assembled on bottom side of the glass-based waveguide panel for 3D coupling between board-level glass waveguides and chip-level silicon waveguides. The laminate has a defined window for direct glass access for assembling of the photonic integrated circuit chip and optical coupling element. The paper describes the design, fabrication and characterization of glass-based electro-optical circuit board with format of (228 x 305) mm2.

Single-mode board-level interconnects for silicon photonics

An optical interconnection technology for 1310/1550nm has been successfully developed with single-mode glass waveguide panels characterizes loss of 0.05dB/cm. The glass has been integrated into a multi-layer electrical printed circuit board for silicon photonic assembly.

Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application

The future need for more bandwidth forces the development of optical transmission solutions for rack-to-rack, boardto- board and chip-to-chip interconnects. The goals are significant reduction of power consumption, highest density and potential for bandwidth scalability to overcome the limitations of the systems today with mostly copper based interconnects. For system integration the enabling of thin glass as a substrate material for electro-optical components with integrated micro-optics for efficient light coupling to integrated optical waveguides or fibers is becoming important. Our glass based packaging approach merges micro-system packaging and glass integrated optics. This kind of packaging consists of a thin glass substrate with integrated micro lenses providing a platform for photonic component assembly and optical fiber or waveguide interconnection. Thin glass is commercially available in panel and wafer size and characterizes excellent optical and high frequency properties. That makes it perfect for microsystem packaging. A suitable micro lens approach has to be comparable with different commercial glasses and withstand post-processing like soldering. A benefit of using laser ablated Fresnel lenses is the planar integration capability in the substrate for highest integration density. In the paper we introduce our glass based packaging concept and the Fresnel lens design for different scenarios like chip-to-fiber, chip-to-optical-printed-circuit-board coupling. Based on the design the Fresnel lenses were fabricated by using a 157 nm fluorine laser ablation system.

Array fiber welding on micro optical glass substrates for chip-to-fiber coupling

High bandwidth parallel optical transceivers are highly demanded for optical interconnects in data centers and in high performance computing. Such transceivers are composed of VCSEL- and photodiode components which have to be fiber coupled, and the appropriate driving and amplifying circuitry. For high density fiber optical connectors lens arrays for improved coupling efficiency have to be used. We propose an advantageous adhesive free method to interconnect optical fibers with such kind of lens arrays. Common approaches using adhesive bonding have high challenges in terms of yield, reliability and optical performance. We introduce our novel fiber welding approach for joining directly fused silica fibers on borosilicate glass substrates with integrated micro optics, e.g. lenses and lens arrays. It is a thermal process with a precise heat input by CO2-laser processing, which is combinable with sequential passive or active alignment of each single fiber to the substrate causing flexibility and highest coupling efficiencies. Since the fiber is accessed only from one side, a two dimensional high-density fiber array can be realized. The manufacturing time of such an interconnection is very short. Due to the adhesive free interface high power transmission is enabled and the occurrence of polymer caused misalignment and degradation are prevented. The paper presents current results in thin glass-based opto-electronic packaging. In particular our laboratory setup for array fiber welding and experimental results of such connections will be discussed and compared to UV-adhesive joining. Also further investigation, for example optical characterization and reliability tests are included. Finally a machine concept, which is under development, will be discussed.

Universal test system for system embedded optical interconnect

We introduce a universal test and measurement system allowing comparative characterisation of optical transceivers, board-to-board optical connectors and both embedded and passive optical circuit boards. The system comprises a test enclosure with interlocking and interchangeable test cards, allowing different technologies spanning different Technology Readiness Levels to be both characterised alone and in combination with other technologies. They form part of the open test design standards portfolio developed on the FP7 PhoxTroT and H2020 COSMICC projects and allow testing on a common test platform.

Demonstration of glass-based photonic interposer for mid-board-optical engines and electrical-optical circuit board (EOCB) integration strategy

Due to its optical transparency and superior dielectric properties glass is regarded as a promising candidate for advanced applications as active photonic interposer for mid-board-optics and optical PCB waveguide integration. The concepts for multi-mode and single-mode photonic system integration are discussed and related demonstration project results will be presented. A hybrid integrated photonic glass body interposer with integrated optical lenses for multi-mode data communication wavelength of 850 nm have been realized. The paper summarizes process developments which allow cost efficient metallization of TGV. Electro-optical elements like photodiodes and VCSELs can be directly flip-chip mounted on the glass substrate according to the desired lens positions. Furthermore results for a silicon photonic based single-mode active interposer integration onto a single mode glass made EOCB will be compared in terms of packaging challenges. The board level integration strategy for both of these technological approaches and general next generation board level integration concepts for photonic interposer will be introductorily discussed.