Marcus Bender

Split sputter mode: a novel sputtering method for flat-panel display manufacturing

Advanced static DC magnetron sputtering methods based on the magnet wobbling technique were investigated to achieve highly uniform and homogeneous metallization layers. The novel split sputter mode (SSM) method, wherein the deposition process is divided into two distinct steps, enables the AKT rotary cathode technology to provide excellent layer properties, while keeping a high production throughput. The effectiveness of the SSM technique was demonstrated through copper-coated large-area substrates.

30.4: Vertical Inline Deposition Technology for Full‐Color OLED Production

Linear evaporation sources for substrates of up to 400 × 470 mm2 have been developed. The thermal load on the substrate during deposition has been reduced and the influence of different grain sizes has been analyzed. Automatic rate control gave stable deposition rate over three days. For full-color OLED production a mask alignment system for the vertical inline deposition technology has been developed. The system handles substrate sizes of 370×470 mm2 and achieves a precision of better than +/− 5 μm. Mask cleaning is carried out in vacuum for long mask life and process stability.

38.5L: Late-News Paper: PVD SiO2 for Metal-Oxide TFT Application

IGZO TFTs are promising candidates to drive future high performance AM LCDs. Since IGZO is known to be sensitive to hydrogen new deposition processes for the adjacent dielectric thin films are needed. We developed a full-reactive hydrogen-free sputter process for SiO2 which shows a performance comparable to the state-of-art CVD dielectrics. We demonstrated that our sputtered SiO2 thin films are stable to electric fields of above 10 MV/cm and show leakage currents below 10−8 A/cm2 at 6 MV/cm.