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Mark R. Schneider

LSI Corporation

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Publication

Featured researches published by Mark R. Schneider.

Archive | 1992

Heat sink for semiconductor device assembly

Michael D. Rostoker; Mark R. Schneider; Edwin M. Fulcher

Archive | 1996

Method of assembling ball bump grid array semiconductor packages

Michael D. Rostoker; Mark R. Schneider; Edwin M. Fulcher

Archive | 1992

Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same

Mark R. Schneider

Archive | 1995

Technique for mounting a semiconductor die

Michael D. Rostoker; Mark R. Schneider

Archive | 1996

Conductive epoxy grid array semiconductor packages

Mark R. Schneider

Archive | 1995

Semiconductor device package fabrication method and apparatus

Mark R. Schneider; Robert T. Trabucco

Archive | 1995

Method of manufacturing powdered metal heat sinks having increased surface area

Michael D. Rostoker; Mark R. Schneider

Archive | 1996

Electronic system having fluid-filled and gas-filled thermal cooling of its semiconductor devices

Michael D. Rostoker; Mark R. Schneider; Nicholas F. Pasch

Archive | 1996

Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array

Dexin Liang; Mark R. Schneider

Archive | 1995

Printable superconductive leadframes for semiconductor device assembly

Michael D. Rostoker; Mark R. Schneider; Chok J. Chia

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Michael D. Rostoker

LSI Corporation

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Joseph Joroski

LSI Corporation

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Michael J. Steidl

LSI Corporation

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Nicholas F. Pasch

LSI Corporation

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Abraham Yee

LSI Corporation

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Dexin Liang

LSI Corporation

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Edwin M. Fulcher

LSI Corporation

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William C. Schneider

LSI Corporation

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Chok J. Chia

LSI Corporation

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Gerald K. Fehr

LSI Corporation

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