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Chok J. Chia

LSI Corporation

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Publication

Featured researches published by Chok J. Chia.

Archive | 1996

Stacked integrated chip package and method of making same

Maniam Alagaratnam; Qwai H. Low; Chok J. Chia

Archive | 1997

Molded laminate package with integral mold gate

Qwai H. Low; Manickam Thavarajah; Chok J. Chia; Maniam Alagaratnam

Archive | 1996

Apparatus and method for stackable molded lead frame ball grid array packaging of integrated circuits

Chok J. Chia; Seng-Sooi Lim; Qwai H. Low

Archive | 1997

System and method for packaging an integrated circuit using encapsulant injection

Chok J. Chia; Seng Sooi Lim; Maniam Alagaratnam

Archive | 1994

Integrated circuit having a coplanar solder ball contact array

Patrick Variot; Chok J. Chia; Robert T. Trabucco

Archive | 1997

Grooved semiconductor die for flip-chip heat sink attachment

Chok J. Chia; Seng-Sooi Lim; Maniam Alagaratnam

Archive | 1992

Partially-molded, PCB chip carrier package

Chok J. Chia; Seng-Sooi Lim

Archive | 1998

Thermally enhanced tape ball grid array package

Chok J. Chia; Seng-Sooi Lim; Owai H. Low

Archive | 1993

Partially-molded, PCB chip carrier package for certain non-square die shapes

Michael D. Rostoker; Chok J. Chia; Seng-Sooi Lim

Archive | 1995

Overmolded semiconductor package

Patrick Variot; Chok J. Chia

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Qwai H. Low

LSI Corporation

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Seng-Sooi Lim

LSI Corporation

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Patrick Variot

LSI Corporation

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Maniam Alagaratnam

LSI Corporation

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Ramaswamy Ranganathan

LSI Corporation

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Robert T. Trabucco

LSI Corporation

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Seng Sooi Lim

LSI Corporation

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Maurice O. Othieno

LSI Corporation

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Wee K. Liew

LSI Corporation

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Charles G. Woychik

IBM

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