Markus Dinkel | Researchain

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Publication

Featured researches published by Markus Dinkel.

Archive | 2013

Overmolded substrate-chip arrangement with heat sink

Peter Ossimitz; Juergen Schaefer; Liu Chen; Markus Dinkel; Stefan Macheiner

Archive | 2008

Semiconductor package with mold lock vent

Bernd Goller; Markus Dinkel; Wae Chet Yong; Teck Sim Lee; Boon Kian Lim

Archive | 2017

POWER PACKAGE WITH INTEGRATED MAGNETIC FIELD SENSOR

Liu Chen; Toni Salminen; Stefan Mieslinger; Giuliano Angelo Babulano; Jens Oetjen; Markus Dinkel; Franz Jost

Archive | 2015

Semiconductor Package with Integrated Magnetic Field Sensor

Thorsten Meyer; Martin Gruber; Rainer Markus Schaller; Franz Jost; Stefan Mieslinger; Liu Chen; Toni Salminen; Giuliano Angelo Babulano; Jens Oetjen; Markus Dinkel

Archive | 2014

Module with Integrated Power Electronic Circuitry and Logic Circuitry

Liu Chen; Markus Dinkel; Toni Salminen

Archive | 2007

Semiconductor module including semiconductor chips coupled to external contact elements

Ralf Otremba; Lutz Goergens; Gerhard Noebauer; Tien Lai Tan; Erwin Huber; Marco Puerschel; Gilles Delarozee; Markus Dinkel

Archive | 2017

Semiconductor Package Having a Source-Down Configured Transistor Die and a Drain-Down Configured Transistor Die

Dirk Ahlers; Markus Dinkel

Archive | 2017

LEADFRAME LEADS HAVING FULLY PLATED END FACES

Stefan Macheiner; Markus Dinkel

Archive | 2016

Electronic module having an electrically insulating structure with material having a low modulus of elasticity

Toni Salminen; Markus Dinkel

Archive | 2016

Multi-Functional Interconnect Module and Carrier with Multi-Functional Interconnect Module Attached Thereto

Giuliano Angelo Babulano; Jens Oetjen; Liu Chen; Toni Salminen; Stefan Mieslinger; Markus Dinkel; Martin Gruber; Franz Jost; Thorsten Meyer; Rainer Markus Schaller

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