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Dive into the research topics where Rainer Markus Schaller is active.

Publication


Featured researches published by Rainer Markus Schaller.


international semiconductor conference | 2017

Lifetime modeling for a simulative evaluation of package reliability in an automotive application

Christine Forster; Jerome Kirscher; Rainer Markus Schaller; Sebastian Simon; Linus Maurer; Georg Pelz

A lifetime model based on metamodeling has been combined with a system-level simulation to virtually evaluate the relationship between the application a semiconductor component will be actuated in, its operating and environmental conditions and the package failures. The lifetime model is derived out of accelerated stress tests.


Archive | 2016

Photo-Acoustic Gas Sensor Module Having Light Emitter and Detector Units

Horst Theuss; Gottfried Beer; Sebastian Beer; Alfons Dehe; Franz Jost; Stefan Kolb; Guenther Ruhl; Rainer Markus Schaller


Archive | 2015

Semiconductor Package with Integrated Magnetic Field Sensor

Thorsten Meyer; Martin Gruber; Rainer Markus Schaller; Franz Jost; Stefan Mieslinger; Liu Chen; Toni Salminen; Giuliano Angelo Babulano; Jens Oetjen; Markus Dinkel


ieee international conference on dielectrics | 2018

Investigation of the partial discharge inception voltage of semiconductor sensor packages at repetitive impulse stress under the variation of pulse

Sebastian Wels; Albert Claudi; Rainer Markus Schaller


international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems | 2017

Lifetime modeling based on anodic oxidation failure for packages with internal galvanic isolation

Rainer Markus Schaller; Volker Strutz; Horst Theuss; Rainer Dudek; Sven Rzepka


Archive | 2017

Chip package, a method of manufacturing a chip package, a method of operating a chip package and a chip package system

Rainer Markus Schaller; Goran Keser; Manuel Harrant


Archive | 2017

SEMICONDUCTOR DEVICE INCLUDING AN ENCAPSULATION MATERIAL DEFINING A THROUGH-HOLE

Volker Strutz; Klaus Elian; Cyrus Ghahremani; Rainer Markus Schaller


Archive | 2017

CHIP PACKAGE, A CHIP PACKAGE SYSTEM, A METHOD OF MANUFACTURING A CHIP PACKAGE, AND A METHOD OF OPERATING A CHIP PACKAGE

Rainer Markus Schaller; Goran Keser; Manuel Harrant


Archive | 2017

INTEGRATED PHOTO-ACOUSTIC GAS SENSOR MODULE

Stefan Kolb; Rainer Markus Schaller; Klaus Elian; Thomas Mueller; Horst Theuss


Archive | 2017

SEMICONDUCTOR DEVICE INCLUDING ANTISTATIC DIE ATTACH MATERIAL

Volker Strutz; Rainer Markus Schaller; Franz-Peter Kalz

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