Martin Fuechsle

A single-atom transistor

Over the past decade we have developed a radical new strategy for the fabrication of atomic-scale devices in silicon [1]. Using this process we have demonstrated few electron, single crystal quantum dots [2], conducting nanoscale wires with widths down to ~1.5nm [3] and most recently a single atom transistor [4]. We will present atomic-scale images and electronic characteristics of these atomically precise devices and demonstrate the impact of strong vertical and lateral confinement on electron transport. We will also discuss the opportunities ahead for atomic-scale quantum computing architectures and some of the challenges to achieving truly atomically precise devices in all three spatial dimensions.

Spectroscopy of few-electron single-crystal silicon quantum dots.

A defining feature of modern CMOS devices and almost all quantum semiconductor devices is the use of many different materials. For example, although electrical conduction often occurs in single-crystal semiconductors, gates are frequently made of metals and dielectrics are commonly amorphous. Such devices have demonstrated remarkable improvements in performance over recent decades, but the heterogeneous nature of these devices can lead to defects at the interfaces between the different materials, which is a disadvantage for applications in spintronics and quantum information processing. Here we report the fabrication of a few-electron quantum dot in single-crystal silicon that does not contain any heterogeneous interfaces. The quantum dot is defined by atomically abrupt changes in the density of phosphorus dopant atoms, and the resulting confinement produces novel effects associated with energy splitting between the conduction band valleys. These single-crystal devices offer the opportunity to study how very sharp, atomic-scale confinement--which will become increasingly important for both classical and quantum devices--influences the operation and performance of devices.

A surface code quantum computer in silicon

A scalable shared-control architecture for silicon-based quantum computing using topological quantum error correction. The exceptionally long quantum coherence times of phosphorus donor nuclear spin qubits in silicon, coupled with the proven scalability of silicon-based nano-electronics, make them attractive candidates for large-scale quantum computing. However, the high threshold of topological quantum error correction can only be captured in a two-dimensional array of qubits operating synchronously and in parallel—posing formidable fabrication and control challenges. We present an architecture that addresses these problems through a novel shared-control paradigm that is particularly suited to the natural uniformity of the phosphorus donor nuclear spin qubit states and electronic confinement. The architecture comprises a two-dimensional lattice of donor qubits sandwiched between two vertically separated control layers forming a mutually perpendicular crisscross gate array. Shared-control lines facilitate loading/unloading of single electrons to specific donors, thereby activating multiple qubits in parallel across the array on which the required operations for surface code quantum error correction are carried out by global spin control. The complexities of independent qubit control, wave function engineering, and ad hoc quantum interconnects are explicitly avoided. With many of the basic elements of fabrication and control based on demonstrated techniques and with simulated quantum operation below the surface code error threshold, the architecture represents a new pathway for large-scale quantum information processing in silicon and potentially in other qubit systems where uniformity can be exploited.

Surface gate and contact alignment for buried, atomically precise scanning tunneling microscopy–patterned devices

The authors have developed a complete electron beam lithography (EBL)-based alignment scheme for making multiterminal Ohmic contacts and gates to buried, planar, phosphorus-doped nanostructures in silicon lithographically patterned by scanning tunneling microscopy (STM). By prepatterning a silicon substrate with EBL-defined, wet-etched registration markers, they are able to align macroscopic contacts to buried, conducting STM-patterned structures with an alignment accuracy of ∼100nm. A key aspect of this alignment process is that, by combining a circular marker pattern with step engineering, they are able to reproducibly create atomically flat, step-free plateaus with a diameter of ∼300nm so that the active region of the device can be patterned on a single atomic Si(100) plane at a precisely known position. To demonstrate the applicability of this registration strategy, they show low temperature magnetoresistance data from a 50nm wide phosphorus-doped silicon nanowire that has been STM-patterned onto a si...

A Tight‐Binding Study of Single‐Atom Transistors

A detailed theoretical study of the electronic and transport properties of a single atom transistor, where a single phosphorus atom is embedded within a single crystal transistor architecture, is presented. Using a recently reported deterministic single-atom transistor as a reference, the electronic structure of the device is represented atomistically with a tight-binding model, and the channel modulation is simulated self-consistently with a Thomas-Fermi method. The multi-scale modeling approach used allows confirmation of the charging energy of the one-electron donor charge state and explains how the electrostatic environments of the device electrodes affects the donor confinement potential and hence extent in gate voltage of the two-electron charge state. Importantly, whilst devices are relatively insensitive to dopant ordering in the highly doped leads, a ∼1% variation of the charging energy is observed when a dopant is moved just one lattice spacing within the device. The multi-scale modeling method presented here lays a strong foundation for the understanding of single-atom device structures: essential for both classical and quantum information processing.

Probing the quantum states of a single atom transistor at microwave frequencies

The ability to apply gigahertz frequencies to control the quantum state of a single P atom is an essential requirement for the fast gate pulsing needed for qubit control in donor-based silicon quantum computation. Here, we demonstrate this with nanosecond accuracy in an all epitaxial single atom transistor by applying excitation signals at frequencies up to ≈13 GHz to heavily phosphorus-doped silicon leads. These measurements allow the differentiation between the excited states of the single atom and the density of states in the one-dimensional leads. Our pulse spectroscopy experiments confirm the presence of an excited state at an energy ≈9 meV, consistent with the first excited state of a single P donor in silicon. The relaxation rate of this first excited state to the ground state is estimated to be larger than 2.5 GHz, consistent with theoretical predictions. These results represent a systematic investigation of how an atomically precise single atom transistor device behaves under radio frequency excitations.

Charge sensing of a few-donor double quantum dot in silicon

We demonstrate the charge sensing of a few-donor double quantum dot precision placed with atomic resolution scanning tunnelling microscope lithography. We show that a tunnel-coupled single electron transistor (SET) can be used to detect electron transitions on both dots as well as inter-dot transitions. We demonstrate that we can control the tunnel times of the second dot to the SET island by ∼4 orders of magnitude by detuning its energy with respect to the first dot.

Spectroscopy of a deterministic single-donor device in silicon

We present a single electron transistor (SET) based on an individual phosphorus dopant atom in an epitaxial silicon environment. Using scanning tunneling microscope (STM) hydrogen lithography, the single impurity is deterministically placed with a spatial accuracy of ± 1 lattice site within a donor-based transport device. Low temperature transport measurements confirm the presence of the single donor and show that the donor charge state can be precisely controlled via gate voltages. We observe a charging energy that is remarkably similar to the value expected for isolated P donors in bulk silicon, which is in sharp contrast to previous experiments on single-dopant transport devices. We show that atomistic modeling can fully capture the effects of the highly-doped transport electrodes on the electronic states of the donor, thus highlighting the high level of control over the electrostatic device properties afforded by a deterministic single donor architecture. Our fabrication method therefore opens the door for the realization of a scalable donor-based qubit architecture in silicon.

Correction to Probing the Quantum States of a Single Atom Transistor at Microwave Frequencies.

Giuseppe Carlo Tettamanzi, Samuel James Hile, Matthew Gregory House, Martin Fuechsle, Sven Rogge, and Michelle Y. Simmons

Electronic spectrum of a deterministic single-donor device in silicon

We report the fabrication of a single-electron transistor (SET) based on an individual phosphorus dopant that is deterministically positioned between the dopant-based electrodes of a transport device in silicon. Electronic characterization at mK-temperatures reveals a charging energy that is very similar to the value expected for isolated P donors in a bulk Si environment. Furthermore, we find indications for bulk-like one-electron excited states in the co-tunneling spectrum of the device, in sharp contrast to previous reports on transport through single dopants.