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Publication
Featured researches published by Mary Beth Rothwell.
Physical Review B | 2012
Chad Rigetti; Jay M. Gambetta; Stefano Poletto; B.L.T. Plourde; Jerry M. Chow; Antonio Corcoles; John A. Smolin; Seth T. Merkel; J. R. Rozen; George A. Keefe; Mary Beth Rothwell; Mark B. Ketchen; Matthias Steffen
We report a superconducting artificial atom with a coherence time of
IEEE Transactions on Components and Packaging Technologies | 2007
Evan G. Colgan; Bruce K. Furman; Michael A. Gaynes; Willian S. Graham; Nancy C. LaBianca; John Harold Magerlein; Robert J. Polastre; Mary Beth Rothwell; Raschid J. Bezama; Rehan Choudhary; Kenneth C. Marston; Hilton T. Toy; Jamil A. Wakil; Jeffrey A. Zitz; Roger R. Schmidt
{T}_{2}^{*}=92
semiconductor thermal measurement and management symposium | 2005
Evan G. Colgan; Bruce K. Furman; A. Gaynes; W. Graham; Nancy C. LaBianca; John Harold Magerlein; Robert J. Polastre; Mary Beth Rothwell; R.J. Bezama; R. Choudhary; K. Marston; H. Toy; Jamil A. Wakil; J. Zitz
Applied Physics Letters | 2013
Josephine B. Chang; Michael R. Vissers; Antonio Corcoles; Martin Sandberg; Jiansong Gao; David W. Abraham; Jerry M. Chow; Jay Gambetta; Mary Beth Rothwell; George A. Keefe; Matthias Steffen; David P. Pappas
\ensuremath{\mu}
Applied Physics Letters | 2011
Antonio Corcoles; Jerry M. Chow; Jay M. Gambetta; Chad Rigetti; J. R. Rozen; George A. Keefe; Mary Beth Rothwell; Mark B. Ketchen; Matthias Steffen
s and energy relaxation time
Ibm Journal of Research and Development | 1998
Evan G. Colgan; Paul Matthew Alt; Robert L. Wisnieff; Peter M. Fryer; Eileen A. Galligan; William S. Graham; Paul F. Greier; Raymond Robert Horton; Harold Ifill; Leslie Charles Jenkins; Richard A. John; Richard I. Kaufman; Yue Kuo; Alphonso P. Lanzetta; Kenneth F. Latzko; Frank R. Libsch; Shui-Chih Alan Lien; Steven Edward Millman; Robert Wayne Nywening; Robert J. Polastre; Carl G. Powell; Rick A. Rand; John J. Ritsko; Mary Beth Rothwell; John L. Staples; Kevin W. Warren; J. Wilson; Steven L. Wright
{T}_{1}=70
Superconductor Science and Technology | 2016
Oliver Dial; Douglas McClure; Stefano Poletto; George A. Keefe; Mary Beth Rothwell; Jay Gambetta; David W. Abraham; Jerry M. Chow; Matthias Steffen
Emerging Lithographic Technologies IX | 2005
Steven E. Steen; Sharee J. McNab; Lidija Sekaric; Inna V. Babich; Jyotica V. Patel; J. Bucchignano; Michael J. Rooks; David M. Fried; Anna W. Topol; J. R. Brancaccio; Roy Yu; John M. Hergenrother; James P. Doyle; Ron Nunes; R. Viswanathan; Sampath Purushothaman; Mary Beth Rothwell
\ensuremath{\mu}
Journal of Vacuum Science & Technology B | 1989
Kaolin Grace Chiong; Mary Beth Rothwell; Shalom J. Wind; J. Bucchignano; Fritz Juergen Hohn; Richard Kvitek
s. The system consists of a single Josephson junction transmon qubit on a sapphire substrate embedded in an otherwise empty copper waveguide cavity whose lowest eigenmode is dispersively coupled to the qubit transition. We attribute the factor of four increase in the coherence quality factor relative to previous reports to device modifications aimed at reducing qubit dephasing from residual cavity photons. This simple device holds promise as a robust and easily produced artificial quantum system whose intrinsic coherence properties are sufficient to allow tests of quantum error correction.
Journal of Physics: Condensed Matter | 2010
Matthias Steffen; Frederico Brito; Matthew J. Farinelli; George A. Keefe; Mark B. Ketchen; Shwetank Kumar; F. P. Milliken; Mary Beth Rothwell; J. R. Rozen; R. H. Koch
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2 /W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35kPa. Further, cooling of a thermal test chip with a microchannel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300W/cm2. Coolers of this design should be able to cool chips with average power densities of 400W/cm2 or more